Failure Mode Analysis of Binders-UHPC Based on Surface Energy Theory
LI Jia1,2,*, XIAO Peng1, FAN Siyuan1, ZHOU Yiwu1
1 College of Civil Engineering, Hunan University, Changsha 410082, China 2 Key Laboratory for Wind and Bridge Engineering of Hunan Province, Hunan University, Changsha 410082, China
Abstract: To investigate the potential bond mechanism and failure mode between binders and UHPC, the adhesive model and spalling model of binder-UHPC were established through the surface energy theory. The guidelines for determining the bond failure mode were proposed. Four commonly used binders: the hot-melt modified epoxy resin 202, the high-viscoelastic asphalt (Bao Li), the high-viscoelastic asphalt PG-100, and the SBS (styrene butadiene styrene)-modified asphalt were selected as the objects of the study. The contact angle method was used to measure the surface energy parameters of UHPC and the binders. The cohesive work and spalling work of the binders, the interfacial adhesive work and spalling work of the binder-UHPC were calculated. Bond failure types of the binder-UHPC systems were determined according to the failure mode criterion. According to the test results, the interfacial adhesive work of the binder-UHPC systems was ranked as follows: the resin 202>the high viscosity asphalt>the asphalt PG-100>the SBS-modified asphalt. The cohesive work of the binders was ranked as follows: the resin 202>the SBS-modified asphalt>the asphalt PG-100>the high viscosity asphalt. Under the dry condition, the binder cohesive work was much smaller than the interfacial adhesive work of the binder-UHPC systems, indicating the cohesive failure of the binders. There is a strong linear correlation between pull-off strength and binder cohesive work. Under the presence of water, the binder spalling work was larger than the interfacial spalling work, and the failure type is cohesive failure of binder. The validity of the results were analyzed and verified using the pull-off test as well as existing research. This study has theoretical and practical implications for the investigation of binder-UHPC bond failure mechanism and the improvement of the compatibility of binders.
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