共价有机框架材料的热导和热电应用研究进展

doi:10.11896/cldb.24040129

材料导报

2024, Vol. 38

Issue (12): 24040129-8 https://doi.org/10.11896/cldb.24040129

高分子与聚合物基复合材料

共价有机框架材料的热导和热电应用研究进展

王梓霄, 熊良涛, 李浩源^*

上海大学微电子学院,上海 201800

Research Progress on Thermal Conductivity and Thermoelectricity Applications of Covalent Organic Frameworks (COF) Materials

WANG Zixiao, XIONG Liangtao, LI Haoyuan^*

School of Microelectronics, Shanghai University, Shanghai 201800, China

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摘要共价有机框架(COF)材料是一类由质量较小的原子(C、B、N、O等)通过共价键连接形成的周期性规整多孔材料,其因具有可调节的热导率而适用于多种热相关应用。高热导率的COF材料可用于器件散热器等热管理模块,而低热导率的COF材料可以利用热电效应将温度梯度转化为电压,从而提供能源。本文讨论了孔径大小、结晶状态、温度、气体吸附等因素对COF材料热导率的影响规律,综述了目前COF材料的热导率数值范围和近年来利用COF材料导热或者绝热性质以及热电性质的应用研究工作,最后对COF在热导方面的发展方向进行了总结和展望,希望能为COF材料热导和热电相关应用的进一步发展提供参考和启发。

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关键词: 共价有机框架多孔材料纳米材料热导率热电

Abstract: Covalent organic framework (COF) materials are a class of periodically ordered porous materials formed by light atoms (C, B, N, O, etc.) connected through covalent bonds, featuring adjustable thermal conductivity suitable for various thermal applications. COF materials with high thermal conductivity can be utilized in heat management modules like device heat sinks, while those with low thermal conductivity can leverage the thermoelectric effect to convert temperature gradients into voltage, thereby providing energy. This review discusses the influence of factors such as pore size, crystalline state, temperature, gas adsorption, etc., on the thermal conductivity of COF materials. It summarizes the range of thermal conductivity values of current COF materials and recent research on utilizing COF materials for thermal conduction or insulating properties and thermoelectricity properties. Finally, the review provides a summary and outlook on the development direction of COF in terms of thermal conduction, aiming to offer insights and inspiration for further advancements in COF-related thermal applications.

Key words: covalent organic framework porous material nanomaterials thermal conductivity thermoelectricity

出版日期: 2024-06-25 发布日期: 2024-07-17

ZTFLH:

TB34

基金资助: 国家自然科学基金(22103053)

通讯作者: *李浩源,上海大学微电子学院教授、博士研究生导师。2006年吉林大学化学专业本科毕业,2015年清华大学化学系化学专业博士毕业。目前主要材料多尺度模拟等方面的研究工作。在J.Am.Chem.Soc.、Energy Environ.Sci.、Adv.Funct.Mater.、Chem.Mater.等期刊发表论文40余篇。lihaoyuan@shu.edu.cn

作者简介: 王梓霄,2016年6月于哈尔滨工业大学获得工学学士学位。现为上海大学微电子学院硕士研究生,在李浩源教授的指导下进行研究。目前主要研究领域为共价有机框架材料。

引用本文:

王梓霄, 熊良涛, 李浩源. 共价有机框架材料的热导和热电应用研究进展[J]. 材料导报, 2024, 38(12): 24040129-8.
WANG Zixiao, XIONG Liangtao, LI Haoyuan. Research Progress on Thermal Conductivity and Thermoelectricity Applications of Covalent Organic Frameworks (COF) Materials. Materials Reports, 2024, 38(12): 24040129-8.

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http://www.mater-rep.com/CN/10.11896/cldb.24040129 或 http://www.mater-rep.com/CN/Y2024/V38/I12/24040129

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