Properties and Microstructure of Sn Solder Joint Reinforced by TiN Nanoparticles
SUN Lei1,2, HE Peng2,*, ZHANG Liang3, ZHANG Shuye2, WANG Wenhao1, ZHANG Panjie1
1 School of Mechanical Engineering and Rail Transit, Changzhou University, Changzhou 213164, Jiangsu, China 2 State Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, China 3 School of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361024, Fujian, China
Abstract: The wettability, mechanical properties and microstructure of Sn-xTiN (x=0, 0.05, 0.1, 0.2, 0.3, 0.4, mass fraction, %) solder were stu-died by contact angle measuring instrument, universal testing machine and scanning electron microscopy (SEM). The results show that the wettability and the mechanical properties of the Sn solder joint are enhanced significantly by adding TiN nanoparticles. When the addition content of TiN nanoparticles reaches 0.2%, the contact angle of the solder decreases from the initial 16.5° to 13.8°, a decrease of 16.4%, and the shear strength of solder joint increases by 24.0%. For microstructures, the thickness of intermetallic compound (IMC) in Sn-xTiN/Cu solder joints decreases from the initial 6.5 μm to 5.8 μm with the addition of TiN nanoparticles. However, the interfacial IMC thickness of solder joints gradually increases with the addition of TiN nanoparticles.
孙磊, 何鹏, 张亮, 张墅野, 王文昊, 张潘杰. TiN纳米颗粒增强Sn焊点的性能与组织研究[J]. 材料导报, 2025, 39(10): 24030018-4.
SUN Lei, HE Peng, ZHANG Liang, ZHANG Shuye, WANG Wenhao, ZHANG Panjie. Properties and Microstructure of Sn Solder Joint Reinforced by TiN Nanoparticles. Materials Reports, 2025, 39(10): 24030018-4.
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2025, Vol. 39 
