Effect of Ni/P Mass Ratio on Microstructure and Properties of Cu-Ni-P Alloy
ZHANG Jianbo1, SHEN Qifei1,2, YIN Ningkang1,2, ZHANG Jinhan1,2, LIU Jingxuan1,2,*
1 Faculty of Materials Metallurgy and Chemistry, Jiangxi University of Science and Technology, Ganzhou 341000, Jiangxi, China 2 Jiangxi Advanced Copper Industry Research Institute, Yingtan 335000, Jiangxi, China
Abstract: The Cu-Ni-P alloys were designed and prepared with varying Ni/P mass ratios based on phase diagrams. The effects of the Ni/P mass ratio on the microstructure and properties of the alloys were investigated by means of optical microscopy (OM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), hardness and conductivity tests. In addition, the correlation between the evolution of precipitated phase and the hardness and conductivity has been established. The results show that the Ni/P mass ratio has a significant impact on the both hardness and conductivity of the alloy. After aging at 500 ℃ for 3 h, the hardness and conductivity of the alloy with a Ni/P mass ratio of 4 reached the maximum of 171HV and 61.8%IACS, respectively. The increase in P content facilitates the precipitation of Ni atoms from the copper matrix, thereby reducing the concentration of solute atoms and ultimately enhancing the electrical conductivity of the alloy. In the early stage of aging, abundant spheroidal NiP3 phase formation serves as a primary factor contributing to increased alloy hardness. During the aging process, the precipitates in the alloy gradually transforms into spherical NiP2 and short rod-like Ni2P phases.
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2025, Vol. 39 
