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材料导报  2024, Vol. 38 Issue (23): 23080181-13    https://doi.org/10.11896/cldb.23080181
  金属与金属基复合材料 |
电子封装用纳米级无铅钎料的研究进展
黄玺1, 张亮1,*, 王曦2, 陈晨2, 卢晓2
1 厦门理工学院材料科学与工程学院,福建 厦门 361024
2 江苏师范大学机电工程学院,江苏 徐州 221116
Research Progress of Nanoscale Lead-free Solder in Electronic Packaging
HUANG Xi1, ZHANG Liang1,*, WANG Xi2, CHEN Chen2, LU Xiao2
1 School of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361024, Fujian, China
2 School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou 221116, Jiangsu, China
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摘要 随着电子工业的不断发展,封装技术呈现出多功能化、高密度、高集成的发展趋势。焊点作为连接芯片和基板的重要一环,其强度和可靠性面临着巨大的挑战。近年来,随着纳米科技的兴起,许多研究者尝试将钎焊材料的尺寸缩小至纳米级,纳米级钎料的热稳定性、导电性、润湿性等一些方面的性能与常规钎料相比有着不同程度的提高。本工作总结了近年来研究较多的几种纳米钎料的制备方法,重点分析了以化学还原法为主导的纳米级钎料的制备工艺;通过分析纳米SnAgCu、SnAg、SnBi、烧结Ag钎料显微组织的演化,总结了钎料纳米化后的改性机理;最后还讨论了现阶段钎料纳米化难以突破的问题以及不足之处,为纳米无铅钎料的进一步研究提供理论支撑。
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黄玺
张亮
王曦
陈晨
卢晓
关键词:  电子封装  纳米级钎料  制备工艺  改性机理    
Abstract: With the continuous development of the electronics industry, packaging technology presents the development trend of multi-function, high density and high integration. The solder joint plays an important interconnection between chip and substrate, faces great challenges in strength and reliability. In recent years, with the rise of nanotechnology, many researchers tried to reduce the size of soldering materials to nanometer level for modification. The investigations show that the thermal stability, conductivity, wettability and other properties of the nanoscale sol-ders are improved in different degrees compared with the conventional solders. In this work, several preparation methods of nano-brazing metal which have been widely used in recent years are summarized and the preparation process of nano-brazing metal dominated by chemical reduction method is emphatically analyzed, by analyzing the microstructure evolution of SnAgCu, SnAg, SnBi and Ag-sintered solder, the modification mechanism summarized. Finally the problems that are difficult to break through in the field of solder nanocrystallization and the shortcomings are discussed, which can provide theoretical support for further research of nanoscale lead-free solders.
Key words:  electronic packaging    nanoscale solders    preparation technology    modification mechanism
出版日期:  2024-12-10      发布日期:  2024-12-10
ZTFLH:  TG42  
基金资助: 厦门理工学院高层次人才研究启动项目(YKJ22054R); 福建省“闽江学者”特聘教授人才项目
通讯作者:  * 张亮,福建省“闽江学者”特聘教授。2006年7月毕业于南昌航空大学获材料成型与控制工程专业学士学位,2011年5月毕业于南京航空航天大学获材料加工工程专业博士学位。2013年4月至2014年7月作为公派访问学者至美国加州大学洛杉矶分校电子薄膜实验室从事访问研修。主要从事钎焊材料与技术、电子封装技术、无铅互连与可靠性的研究工作,发表学术论文 100 余篇。zhangliang@jsnu.edu.cn   
作者简介:  黄玺,2017年6月毕业于吉林建筑大学,获得工学学士学位。现为厦门理工学院材料科学与工程学院硕士研究生,在张亮教授的指导下进行研究。目前主要研究领域为无铅钎料及互连技术。
引用本文:    
黄玺, 张亮, 王曦, 陈晨, 卢晓. 电子封装用纳米级无铅钎料的研究进展[J]. 材料导报, 2024, 38(23): 23080181-13.
HUANG Xi, ZHANG Liang, WANG Xi, CHEN Chen, LU Xiao. Research Progress of Nanoscale Lead-free Solder in Electronic Packaging. Materials Reports, 2024, 38(23): 23080181-13.
链接本文:  
http://www.mater-rep.com/CN/10.11896/cldb.23080181  或          http://www.mater-rep.com/CN/Y2024/V38/I23/23080181
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