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材料导报  2025, Vol. 39 Issue (3): 24010216-6    https://doi.org/10.11896/cldb.24010216
  金属与金属基复合材料 |
SnBiAg无铅钎料恒温激光焊接的数值模拟与实验研究
冯超1,2, 杨子帆1,2, 刘曰利1,3,*
1 武汉理工大学材料科学与工程学院,武汉 430070
2 硅酸盐建筑材料国家重点实验室,武汉 430070
3 武汉理工大学三亚科教创新园,海南 三亚 572024
A Numerical and Experimental Study of the Thermostatic Laser Welding Process of SnBiAg Lead-free Solder
FENG Chao1,2, YANG Zifan1,2, LIU Yueli1,3,*
1 School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
2 State Key Laboratory of Silicate Materials for Architectures, Wuhan 430070, China
3 Sanya Science and Education Innovation Park, Wuhan University of Technology, Sanya 572024, Hainan, China
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摘要 本工作采用有限元分析方法建立SnBiAg无铅焊料恒温激光焊接过程的三维瞬态数值模型,研究热源选择对仿真结果的影响,并揭示激光工艺参数与钎料微观结构之间的关系。数值模拟结果表明,具有矩形截锥分布的热源更适用于恒温激光焊接的数值模拟;在不同激光焊接参数下,焊点的温度分布呈现出显著变化的趋势。实验结果表明,焊接温度和时间对焊料的微观结构具有重要影响,进一步验证了数值模型的准确性。此外,通过适当提高焊接温度和延长焊接时间,可以使得焊料中的各组分分布更加均匀。此研究为进一步优化恒温激光焊接工艺提供一种新的指导思路。
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冯超
杨子帆
刘曰利
关键词:  有限元分析  热分布仿真  激光焊接  SnBiAg无铅焊料  微观结构    
Abstract: This work investigates the thermostatic welding process of SnBiAg lead-free solder through establishing a three-dimensional transient numerical model by employing the finite element method, considering the influence of the choice of heat source, and reveals the relationship between laser process parameters and microstructure. The numerical simulation results demonstrate that a heat source with a rectangular-truncated-pyramid-like distribution is suitable for thermostatic laser welding processes. Under different parameters, significant temperature variations are observed in solder joints at different positions. The experimental results indicate that the welding temperature and time have a substantial influence on the microstructure of the solder. The phase distribution in the solder may be made more uniform by appropriately increasing the welding temperature and extending the welding time. The optimal process parameters for the thermostatic laser welding of SnBiAg are determined as a wel-ding temperature of 210 ℃ and a welding time of 15 s.
Key words:  finite element analysis    thermal-distribution simulation    laser welding    SnBiAg solder    microstructure
出版日期:  2025-02-10      发布日期:  2025-02-05
ZTFLH:  TG425  
基金资助: 国家自然科学基金(12174298);三亚科技创新工程(2022KJCX85)
通讯作者:  *刘曰利,武汉理工大学硅酸盐建筑材料国家重点实验研究员、博士研究生导师。2001年武汉大学物理科学与技术学院应用物理学专业本科毕业,2006年武汉大学物理科学与技术学院材料物理与化学专业硕博连读毕业后到武汉理工大学大学工作至今。目前主要从事新材料、激光焊接等方面的研究工作。lylliuwhut@whut.edu.cn   
作者简介:  冯超,2021年6月于武汉理工大学获得工学学士学位。现为武汉理工大学材料科学与工程学院的硕士研究生,在刘曰利教授的指导下进行研究。目前主要研究领域为激光焊接数值模拟与实验。
引用本文:    
冯超, 杨子帆, 刘曰利. SnBiAg无铅钎料恒温激光焊接的数值模拟与实验研究[J]. 材料导报, 2025, 39(3): 24010216-6.
FENG Chao, YANG Zifan, LIU Yueli. A Numerical and Experimental Study of the Thermostatic Laser Welding Process of SnBiAg Lead-free Solder. Materials Reports, 2025, 39(3): 24010216-6.
链接本文:  
http://www.mater-rep.com/CN/10.11896/cldb.24010216  或          http://www.mater-rep.com/CN/Y2025/V39/I3/24010216
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