New Research Progress on Copper/Aluminum Bimetallic Composites
LIU Guoping, WANG Qudong, JIANG Haiyan
National Engineering Research Center of Light Alloy Net Forming, Shanghai Jiao Tong University; State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University; School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Abstract: Bimetallic composite is a hotspot in material research because it integrates the excellent properties of various matrix metals and makes up for the deficiency of single metal. As a typical bimetallic composite, Cu/Al bimetallic composite comprehensively utilizes the advantages of high conductivity and heat conduction of copper, as well as light weight, easy welding and low cost of aluminum, which is widely used in electric po-wer, heat transmission, automobile and other fields, attracting extensive attentions of researchers at home and abroad. However, the main difficulties in preparing Cu/Al bimetallic composites include: (1) both copper and aluminum materials are easy to be oxidized, and the formed oxidation film is difficult to be removed; (2) the interface is easy to form hard and brittle intermetallic compounds, which will harm the performance of Cu/Al bimetallic composites. Therefore, in recent years, researchers have made a lot of researches including how to improve the existing processes and develop new processes; exploring the interface formation mechanism, growth regulation of intermetallic compounds, size and performance matching between component metals, deformation and heat treatment coordination, performance characte-rization and other aspects. The growth of intermetallic compounds is controlled by optimizing process parameters and physical and chemical methods to improve interfacial bonding strength. In-situ characterization is used to observe the phase evolution of the interface and explore the interface bonding mechanism. Combined with the finite element simulation technology, the research on deformation, heat treatment and defect prediction of Cu/Al bimetallic composite is carried out to guide the actual production. The mechanical, electrical, thermal and corrosion resistance properties of Cu/Al bimetallic composites are evaluated comprehensively, and their application potential is explored continuously. In this paper, the preparation process of Cu/Al bimetal is summarized, and the application of combined bonding process is highly reviewed. The research progress of Cu/Al bimetallic composites in the interfacial composition, evolution of interface phase observed by in-situ equipment, evaluation of interface performance and improvement of interfacial bonding performance are reviewed, and the future research direction of Cu/Al bimetallic composites is forecasted.
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