The Evolution of Microstructure and Properties of Directional Solidification Pure Copper During Equal Channel Angular Pressing at Low Temperature
GUO Tingbiao1,2, LI Qi1, WANG Chen1, ZHANG Feng1, DING Yutian1,2, JIA Zhi1,2, TANG Xingchang1,2
1 State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou 730050; 2 Key Laboratory of Non-ferrous Metal Alloys and Processing of Ministry of Education, Lanzhou University of Technology, Lanzhou 730050
Abstract: The microstructure evolution of directional solidification structure in pure copper (99.99%) during equal channel angular pressing (ECAP) after cooling with dry ice was investigated by OM and XRD, the hardness and conductivity were tested. The results manifested that the fibrous structure with same orientation was formed in directional solidification structure in pure copper by route A and C at low temperature, and the characterization of (111) preferred orientation was remained. After deformation by route Bc, columnar crystal of directional solidification structure in pure copper was broken, and homogeneous equiaxed grains were formed, at the same time, the grain orientation tended to be random. The hardness of each route increased drastically after one pass extrusion, which was about 1.8 times in compare with hardness of original sample, with the increase of extrusion passes, the hardness increased slowly, whereas the hardness decreased slightly after four passes extrusion by route Bc. The consistency of grain orientation made the conductivity increased in the condition of low strain, however, with the increase of strain, lattice distortion caused electron scattering, which leaded to a slight decrease in conductivity.
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2018, Vol. 32 
