电力电子器件用液冷针翅散热器的研究进展

doi:10.11896/cldb.23070138

材料导报

2024, Vol. 38

Issue (21): 23070138-11 https://doi.org/10.11896/cldb.23070138

无机非金属及其复合材料

电力电子器件用液冷针翅散热器的研究进展

田小飞^1,2,3, 王林山^1,2,3,4,5,*, 梁雪冰^1,2,3,4,5, 郑逢时^1,2,3,4,5, 胡强^1,2,3,4,5

1 中国有研科技集团有限公司金属粉体材料产业技术研究院,北京 101407
2 有研增材技术有限公司,北京 101407
3 北京有色金属研究总院,北京 100088
4 有研粉末新材料股份有限公司,北京 101407
5 北京市金属粉末工程技术研究中心,北京 101407

Research Progress of Liquid-Cooled Pin-Fin Heatsinks for Power Electronic Devices

TIAN Xiaofei^1,2,3, WNAG Linshan^1,2,3,4,5,*, LIANG Xuebing^1,2,3,4,5, ZHENG Fengshi^1,2,3,4,5, HU Qiang^1,2,3,4,5

1 Metal Powder Materials Industrial Technology Research Institute of China GRINM Group Co., Ltd., Beijing 101407, China
2 GRINM Additive Manufacturing Technology Co., Ltd., Beijing 101407, China
3 General Research Institute for Nonferrous Metals, Beijing 100088, China
4 GRIPM Advanced Materials Co., Ltd., Beijing 101407, China
5 Beijing Engineering Research Center of Metal Powder, Beijing 101407, China

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摘要随着大功率电力电子器件(如绝缘栅双极型晶体管,IGBT)轻量化、小型化和集成化的发展需求,其功率密度越来越大,导致其热流密度越来越高,亟需高效散热来满足其使用要求。传统空气冷却散热器结构简单、使用方便,但是散热能力较低,难以满足高热流密度的散热需求,目前主要采用液体冷却散热器,其中液冷针翅散热器是最常用的高效散热器。本文介绍了液冷针翅散热器的结构、液体工质、材料和制造等方面的研究进展,重点分析了液冷针翅散热器的流体通道结构、针翅结构对流动和传热性能的影响,并给出了液冷针翅散热器的发展建议。

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	田小飞
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	胡强

关键词: 电力电子器件液冷散热器针翅结构传热性能

Abstract: With the development of high-power power electronic devices (such as insulated gate bipolar transistors, IGBT) lightweight, miniaturization and integration needs, their power density is increasing, resulting in higher and higher heat flow density, which urgently needs efficient heat dissipation to meet its use requirements. Traditional air-cooled heat sinks are simple in structure and easy to use, but the heat dissipation capacity istoo low to meet the heat dissipation requirements of high heat flow density, so liquid-cooled heatsinks are mainly used at present, among these liquid-cooled pin-fin heatsinks are the most common and efficient heat dissipation facilities. Here introduces the research progress in the structure, liquid working medium, material and manufacturing of liquid-cooled pin-fin heatsinks, focuses on the influence of fluid channel structure, pin-fin structure on the flow and heat transfer performance of liquid-cooled pin-fin heatsinks, and gives suggestions for the development of liquid-cooled pin-fin heatsinks.

Key words: power electronic devices liquid-cooled heatsink pin-fin structure heat transfer performance

出版日期: 2024-11-10 发布日期: 2024-11-11

ZTFLH:

TK172

基金资助: 国家重点研发计划(2021YFB3701902);北京市科委项目(Z221100005822001);金属粉体材料概念验证平台项目

通讯作者: *王林山,中国有研科技集团有限公司正高级工程师、硕士研究生导师。2000年7月和2003年6月毕业于中南大学粉末冶金研究院分别获工学学士学位和工学硕士学位。主要从事粉末冶金材料与零件、金属粉末高效热管理材料等方面的研究、产品开发和产业化。截至目前,已发表论文40余篇,作为副主编出版“十一五”国家重点图书《铜及铜合金粉末与制品》,制修订国家或行业标准10项,获得省部级奖5项。wls@gripm.com

作者简介: 田小飞,2021年6月毕业于中南大学,获得工学学士学位。现为北京有色金属研究总院硕士研究生,在王林山教授的指导下进行研究。目前主要研究领域为粉末冶金热管理材料。

引用本文:

田小飞, 王林山, 梁雪冰, 郑逢时, 胡强. 电力电子器件用液冷针翅散热器的研究进展[J]. 材料导报, 2024, 38(21): 23070138-11.
TIAN Xiaofei, WNAG Linshan, LIANG Xuebing, ZHENG Fengshi, HU Qiang. Research Progress of Liquid-Cooled Pin-Fin Heatsinks for Power Electronic Devices. Materials Reports, 2024, 38(21): 23070138-11.

链接本文:

http://www.mater-rep.com/CN/10.11896/cldb.23070138 或 http://www.mater-rep.com/CN/Y2024/V38/I21/23070138

1 Wu X L, Li C Y, Yang J L, et al. International Journal of Heat and Mass Transfer, 2023, 205, 123900.
2 Aranzabal I, Martinez de Alegria I, Garate J I, et al. In: 2017 11th IEEE International Conference on Compatibility. Cadiz, Spain, 2017, pp. 501.
3 Bhunia A, Chandrasekaran S, Chen C L. IEEE Transactions on Components and Packaging Technologies, 2007, 30, 309.
4 Valenzuela J, Jasinski T, Sheikh Z. Power Electronics Technology, 2005, 31, 50.
5 Pedersen K B, Pedersen K. In: 2012 3rd IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG). Aalborg, Denmark, 2012, pp. 519.
6 Gekenidis S, Ramezani E, Zeller H. In: 11th International Symposium on Power Semiconductor Devices and ICs. Toronto, Canada, 1999, pp. 129.
7 Ramminger S, Seliger N, Wachutka G. Microelectronics Reliability, 2000, 40, 1521.
8 Smet V, Forest F, Huselstein J J, et al. IEEE Transactions on Industrial Electronics, 2011, 58, 4931.
9 Liu Y. Modeling and simulation of microelectronic devices and packages, Science Press, 2010, 15 (in Chinese).
刘勇.微电子器件及封装的建模与仿真, 科学出版社, 2010, pp. 15.
10 Sohel Murshed S M, Nieto de Castro C A. Renewable and Sustainable Energy Reviews, 2017, 78, 821.
11 Zhang Z H, Wang X H, Yan Y Y. e-Prime - Advances in Electrical Engineering, Electronics and Energy, 2021, 1, 100009.
12 Sarvar F, Whalley D C, Low M K. J Electron Packag, 2001, 123, 338.
13 Cormier Y, Dupuis P, Farjam A, et al. International Journal of Heat and Mass Transfer, 2014, 75, 235.
14 Aranzabal I, Martinez de Alegria I,IEEE Transactions on Power Electro-nics, 2018, 34, 4185.
15 Gao W, Zhang J F, Qu Z G, et al. International Journal of Thermal Sciences, 2021, 164, 106902.
16 Sun X Q, Han Z W, Li X M. Applied Thermal Engineering, 2022, 207, 118142.
17 Zhao J, Du M S, Zhang Z, et al. International Journal of Heat and Mass Transfer, 2021, 181, 100009.
18 Blinov A, Vinnikov D, Lehtla T. Scientific Journal of Riga Technical University Power and Electrical Engineering, 2011, 29, 79.
19 Jiang K, Li T, Zhang Y L. Electronic Science and Technology, 2017, 30(2), 68 (in Chinese).
姜坤, 李涛, 张永亮.电子科技, 2017, 30(2), 68.
20 Tullius J F, Tullius T K, Bayazitoglu Y. International Journal of Heat and Mass Transfer, 2012, 55, 3921.
21 Qi W L, Zhao L, Wang W R, et al. Science Technology and Engineering, 2022, 22(11), 4261 (in Chinese).
齐文亮, 赵亮, 王婉人, 等. 科学技术与工程, 2022, 22(11), 4261.
22 Mertens R G, Chow L, Sundaram K B, et al. Journal of Electronic Pac-kaging, 2007, 129, 316.
23 Wen Y K, Kang Y H, Ruan L. In: 2020 IEEE 5th Information Technology and Mechatronics Engineering Conference. Chengqing, China, 2020, pp. 166.
24 Mohammadi A, Koşar A. Nanoscale and Microscale Thermophysical Engineering, 2018, 22, 153.
25 Al-damook A, Alkasmoul F S. Propulsion and Power Research, 2018, 7, 138.
26 Deng D X, Zeng L, Sun W. International Journal of Heat and Mass Transfer, 2021, 175, 121332.
27 Chu H Q, Yu X Y, Jiang H T, et al. International Journal of Heat and Mass Transfer, 2023, 200, 123530.
28 Gunnasegaran P, Mohammed H A, Shuaib N H, et al. International Communications in Heat and Mass Transfer, 2010, 37, 1078.
29 Wang H T, Chen Z H, Gao J G. Applied Thermal Engineering, 2016, 107, 870.
30 Kose H A, Yildizeli A, Cadirci S. Applied Thermal Engineering, 2022, 211, 118368.
31 Wang J, Yu K, Ye M Z, et al. Energy, 2022, 239, 122606.
32 Ye M Z, Du J Q, Wang J, et al. Energy, 2022, 260, 125000.
33 Wang Y B, Zhu K, Cui Z, et al. Applied Thermal Engineering, 2019, 151, 506.
34 Shahsavar A, Shahmohammadi M, Askari I B. International Communications in Heat and Mass Transfer, 2021, 127, 105500.
35 Hua J Y, Li G, Zhao X B, et al. Applied Thermal Engineering, 2016, 107, 768.
36 Zhao H X, Liu Z G, Zhang C W, et al. Experimental Thermal and Fluid Science, 2016, 71, 57.
37 Wan W, Deng D X, Huang Q S, et al. Applied Thermal Engineering, 2017, 114, 436.
38 Yang D W, Jin Z Y, Wang Y, et al. International Journal of Heat and Mass Transfer, 2017, 113, 366.
39 Yang D W, Wang Y, Ding G F, et al. Applied Thermal Engineering, 2017, 112, 1547.
40 Bhandari P, Padalia D, Ranakoti L, et al. Alexandria Engineering Journal, 2023, 69, 457.
41 Ambreen T, Kim M H. International Journal of Heat and Mass Transfer, 2018, 126, 245.
42 Ambreen T, Saleem A, Park C W. Applied Thermal Engineering, 2019, 158, 113781.
43 Ambreen T, Saleem A, Tanveer M, et al. Case Studies in Thermal Engineering, 2022, 31, 101806.
44 Bahiraei M, Heshmatian S, Goodarzi M, et al. Advanced Powder Techno-logy, 2019, 30, 2503.
45 Zeng L, Deng D X, Zhong N B, et al. International Journal of Mechanical Sciences, 2021, 200, 106445.
46 Qin L W, Zhang X Q, Hua J Y, et al. International Communications in Heat and Mass Transfer, 2022, 133, 105918.
47 Xu Y, Li L, Wang J L. International Journal of Heat and Mass Transfer, 2023, 209, 124079.
48 Yan Y F, Zhao T, He Z Q, et al. Chemical Engineering and Processing-Process Intensification, 2021, 160, 108273.
49 Hosseinirad E, Khoshvaght-Aliabadi M, Hormozi F. International Journal of Heat and Mass Transfer, 2019, 143, 118586.
50 Wang D, Hai T. Engineering Analysis with Boundary Elements, 2023, 146, 216.
51 Ji C, Liu Z G, Lv M M. Chemical Engineering and Processing-Process Intensification, 2022, 179, 109058.
52 Babar H, Wu H W, Ali H M, et al. Thermal Science and Engineering Progress, 2023, 37, 101616.
53 Rostami S, Nadooshan A A, Raisi A, et al. Journal of the Taiwan Institute of Chemical Engineers, 2023, 148, 104811.
54 Feng S, Yan Y F, Li H J, et al. Applied Thermal Engineering, 2019, 153, 748.
55 Zhao J, Huang S B, Gong L, et al. Applied Thermal Engineering, 2016, 93, 1347.
56 Yan Y F, Xue Z G, Xu F L, et al. Applied Thermal Engineering, 2022, 202, 117836.
57 Yan Y F, Wang D D, Xu F L, et al. International Journal of Heat and Mass Transfer, 2022, 186, 122518.
58 Karami M, Tashakor S, Afsari A, et al. Thermal Science and Engineering Progress, 2019, 14, 100417.
59 Jia Y T, Xia G D, Li Y F, et al. International Communications in Heat and Mass Transfer, 2018, 92, 78.
60 Chamanroy Z, Khoshvaght-Aliabadi M. International Journal of Thermal Sciences, 2019, 146, 106071.
61 Mohit M K, Gupta R. Case Studies in Thermal Engineering, 2022, 32, 101884.
62 Lee J, Ki S, Seo D, et al. Applied Thermal Engineering, 2020, 173, 115230.
63 Li Y T, Gong L, Xu M H, et al. International Journal of Heat and Mass Transfer, 2020, 151, 119376.
64 Li Y T, Gong L, Xu M H, et al. Applied Thermal Engineering, 2020, 166, 114665.
65 Zhou W N, Dong K J, Sun Q, et al. International Journal of Energy Research, 2022, 46, 11574.
66 Khattak Z, Ali H M. International Journal of Heat and Mass Transfer, 2019, 130, 141.
67 Chen M G. Fluid Measurement & Contro. 2021, 2(5), 39 (in Chinese).
陈名刚. 流体测量与控制, 2021, 2(5), 39.
68 Han F L. Powder Metallurgy Industey, 2011, 21(1), 1 (in Chinese).
韩凤麟.粉末冶金工业, 2011, 21(1), 1.

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