Effect of Cu Interlayer on GH4099 and Mo-Cu Joint of HIP Diffusion Bonding
WANG Tiejun1,2, ZHANG Longge1, CHE Hongyan2,3, DONG Hao2,3, ZHENG Tianming4, ZHOU Shuangshuang2,3, WANG Xueyuan2,3
1 Central Iron & Steel Research Institute, Beijing 100081, China; 2 Advanced Technology & Materials Limited Company, Beijing 100081, China; 3 Engineering and Technology Research Center of Hot Isostatic Pressing, Baoding 072750, China; 4 State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal, Lanzhou 730050, China
Abstract: Mo-Cu alloy, as a new type of superalloy material, not only has the properties of high-melting-point, low expansion coefficient, but also has the properties of high ductility, high electric conduction and thermal conductivity. It can be applied to lots of fields such as aerospace, nuclear industry, electronics, etc. There’s a burning problem to be solved that how to connect Mo-Cu alloy with GH4099 superalloy which is resis-tant to high temperature and oxidation, to make composite components, so as to avoid the poor high temperature oxidation resistance of Mo alloy, and the disadvantage of low temperature brittleness. As it can be widely used as high temperature structural material. In general, traditional wel-ding is difficult to achieve effective bonding of refractory alloy. HIP can avoid recrystallization in the welding area, what’s more, the large area connection can be realized for materials sensitive to deformation rate. For this reason, the quality of GH4099/Mo-Cu HIP diffusion bonding joints are compared and analyzed by using different thickness of Cu interlayer in this paper. Preparation of Cu interlayer by PVD, the diffusion couples are connected under the proper welding parameters. The interface element migration, diffusion layer evolution and fracture morphology which with different thickness of Cu interlayer were characterized by SEM-EDS, and the mechanical properties of the joint were tested by hardness, tensile and shear tests. The results show that Cu interlayer is beneficial to the connection of diffusion bonding, the PVD coating is better than the foil as the interlayer.
王铁军, 张龙戈, 车洪艳, 董浩, 郑天明, 周双双, 王学远. Cu中间层对GH4099与Mo-Cu合金HIP扩散焊接头的影响[J]. 材料导报, 2021, 35(2): 2098-2102.
WANG Tiejun, ZHANG Longge, CHE Hongyan, DONG Hao, ZHENG Tianming, ZHOU Shuangshuang, WANG Xueyuan. Effect of Cu Interlayer on GH4099 and Mo-Cu Joint of HIP Diffusion Bonding. Materials Reports, 2021, 35(2): 2098-2102.
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2021, Vol. 35 
