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材料导报  2020, Vol. 34 Issue (Z1): 427-432    
  金属与金属基复合材料 |
无掩模定域性电沉积三维微结构的仿真研究
吴建辉, 吴蒙华, 佐姗姗, 钱宁开
大连大学机械工程学院,大连 116622
Simulation Study on 3D Microstructure of Mask-less Localized Electrodeposition
WU Jianhui, WU Menghua, ZUO Shanshan, QIAN Ningkai
School of Mechanical Engineering, Dalian University, Dalian 116622, China
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摘要 为研究基于喷射状态的无掩模定域性电沉积的最佳工艺参数,采用COMSOL Multiphysics仿真软件和实验研究无掩模定域性电沉积三维微结构过程中电流密度、极间距、脉冲占空比对沉积部件表面形貌和沉积速率的影响。结果表明,电流密度对沉积部件形貌、晶粒尺寸、内部气孔和沉积速率有很大影响,当电流密度超过4.5 A/dm2,表面形貌和气孔急剧变差;占空比越小,定域性越好,沉积的圆柱直径越小,极间距为5 μm时,可得到均匀的沉积层。通过正交实验优化得到的工艺参数为:电流密度3.5 A/dm2,极间距5 μm,占空比10%。
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吴建辉
吴蒙华
佐姗姗
钱宁开
关键词:  定域性电沉积  无掩模  多物理场仿真  三维微结构    
Abstract: In order to study the optimal process parameters of mask-less localized electrodeposition based on jet state, COMSOL Multiphysics simulation software and experiment were used to study the effects of current density, interelectrode gap, pulse duty ratio on the surface morphology and deposition rate of the deposition parts in the process of 3D microstructures without mask. The analysis results showed that the current density had a great influence on the morphology, grain size, internal pores and deposition rate of the deposition parts. When the current density exceeded 4.5 A/dm2, the surface morphology and pores dramatically deteriorated; the smaller the duty cycle, the better the localization; the smaller the diameter of the deposited cylinder, and the more uniform the sedimentation layer can be obtained when the polar spacing was 5 μm. The process parameters obtained by orthogonal experiment optimization were: current density 3.5 A/dm2, pole spacing of 5 μm, pulse duty-ratio of 10%.
Key words:  localized electrodeposition    mask-less    multi-physical field simulation    3D microstructure
                    发布日期:  2020-07-01
ZTFLH:  TQ153.4+3  
基金资助: 国家自然科学基金(51875071)
作者简介:  吴建辉,大连大学硕士研究生,2013—2017,大连大学本科生,2017至今,大连大学硕士研究生。曾多次参加辽宁省及全国组织的各种大赛;吴蒙华,大连大学教授,工学博士,博士研究生导师。从教35年以来,先后获得“辽宁省教学名师”、“辽宁特聘教授”、“辽宁省普通高等学校专业带头人”、“辽宁省‘百千万人才工程’百层次人员”、“大连市劳动模范”、“大连市优秀专家”等荣誉称号。
引用本文:    
吴建辉, 吴蒙华, 佐姗姗, 钱宁开. 无掩模定域性电沉积三维微结构的仿真研究[J]. 材料导报, 2020, 34(Z1): 427-432.
WU Jianhui, WU Menghua, ZUO Shanshan, QIAN Ningkai. Simulation Study on 3D Microstructure of Mask-less Localized Electrodeposition. Materials Reports, 2020, 34(Z1): 427-432.
链接本文:  
http://www.mater-rep.com/CN/  或          http://www.mater-rep.com/CN/Y2020/V34/IZ1/427
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