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材料导报  2020, Vol. 34 Issue (Z1): 366-369    
  金属与金属基复合材料 |
Cu/Al界面研究进展
冉小杰, 周露, 黄福祥, 曾利娟
重庆理工大学材料科学与工程学院,重庆 400054
Research Progress on Interface of Cu/Al Composites
RAN Xiaojie, ZHOU Lu, HUANG Fuxiang, ZENG Lijuan
College of Material Science and Engineering, Chongqing University of Technology, Chongqing 400054, China
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摘要 铜铝复合材料是一种性能优异的新型复合材料,由于其具有极高的导电、导热性能和较强的耐腐蚀性,在电子机械等领域有着广泛的应用。但铜铝为异种金属结合且物理化学性质差异较大,使其界面结构十分复杂,因此Cu/Al界面性能被认为是影响复合材料综合性能的主要因素,已引起了人们的广泛关注。本文对Cu/Al界面金属间化合物(Intermetallic compounds,IMC)的组成生长、界面性能以及利用计算模拟方法研究Cu/Al界面等方面进行了综述,并展望了未来发展方向。
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冉小杰
周露
黄福祥
曾利娟
关键词:  铜铝复合材料  界面  金属间化合物(IMC)  性能  计算模拟    
Abstract: Copper-aluminum composite material is a new type of composite material. Because of high conductivity, thermal conductivity and strong corrosion resistance it has wide application in the fields of electronic machinery and so on. However, copper/aluminum is a heterogeneous metal combination and the physicochemical properties are quite different, which makes the interface structure very complicated. Therefore, the Cu/Al interface performance is considered to be the main reason affecting the comprehensive performance of the composite material, which has attracted wide attention. In this paper, growth of Cu/Al interface IMC, interface properties are introduced and the study by computational simulation method in Cu/Al interface is also summarized in this paper. Finally, the development direction are prospected.
Key words:  copper/aluminum composite    interface    intermetallic compound    property    computational simulation
                    发布日期:  2020-07-01
ZTFLH:  TG146  
基金资助: 国家重点研发计划(2016YFB0402602)
作者简介:  冉小杰,2018年6月毕业于西昌学院,获得工学学士学位。现为重庆理工大学材料科学与工程学院研究生,在黄福祥的指导下进行研究。目前主要研究领域为先进功能材料的理论研究;黄福祥,重庆理工大学材料科学与工程学院教授、硕士研究生导师。1985年7月本科毕业于重庆大学材料科学与工程学院,2003年7月获得清华大学材料学专业博士学位。近年来,主要研究的领域涉及金属功能材料、材料计算学、材料表面与界面分析等,在国内外重要刊物如Scripta Materialia等发表论文120余篇,发表论文共被他人引用200余次。
引用本文:    
冉小杰, 周露, 黄福祥, 曾利娟. Cu/Al界面研究进展[J]. 材料导报, 2020, 34(Z1): 366-369.
RAN Xiaojie, ZHOU Lu, HUANG Fuxiang, ZENG Lijuan. Research Progress on Interface of Cu/Al Composites. Materials Reports, 2020, 34(Z1): 366-369.
链接本文:  
http://www.mater-rep.com/CN/  或          http://www.mater-rep.com/CN/Y2020/V34/IZ1/366
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