Abstract: As the centre of power conversion, power devices play an important role in the generation, transmission and energy-efficient utilization of energy. The development of new generation power devices in the direction of high power density and high junction temperature has placed increasing demands on the packaging technology of power modules. Nevertheless, the limitations of the melting point, solderability, cost-effective, and environmental impacts of traditional solder make it difficult to meet the demands of higher operating temperature and higher reliability for the high power module. The packaging technology represented by low-temperature sintering of nanoscale silver has become a research highlight in the field of power module packaging in recent years, thanks to its high heat resistance temperature, and good thermal and electrical conductivity. The research results show that the precise control of the process parameters such as sintering temperature, sintering pressure and oxygen content in the sintering process of nanoscale silver is the key to form a reliable connection. At the same time, in order to further promote the application of low-temperature sintering technology of nanoscale silver in power module packaging, researchers have developed pressureless sintering technology of nanoscale silver, nano/microscale silver particle mixed sintering technology, and auxiliary sintering methods that can satisfy low-temperature rapid sintering (including laser sintering, current-assisted sintering, spark plasma sintering, ultrasonic assisted sintering, etc.). The modified low-temperature sintering technology of nanoscale silver has greatly improved the packaging performance. In this article, the research status of low-temperature sintering technology of nanoscale silver in recent years is reviewed, the mechanism of low-temperature sintering nanoscale silver is summarized, and the influence of different process parameters of nanoscale silver sintering on packaging performance is analyzed. Finally, the development trend of low-temperature sintering nanoscale silver is prospected.
杨金龙, 董长城, 骆健. 新型功率模块封装中纳米银低温烧结技术的研究进展[J]. 材料导报, 2019, 33(Z2): 360-364.
YANG Jinlong, DONG Changcheng, LUO Jian. Development of Low-temperature Sintered Nanoscale Silver for New PowerDevice Packaging. Materials Reports, 2019, 33(Z2): 360-364.
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2019, Vol. 33 
