Abstract: Epoxy resins (EP) are widely used in the field of electrical equipment and electronic packaging insulation materials, owning to their high electrical insulation performance and low dielectric loss. However, their low heat resistance and insufficient toughness had greatly limited their application in microelectronic components under high-frequency. Therefore, this work prepared a novel nano-SiO2(E-SiO2) with terminal epoxy group via the sol-gel process, while the silane coupling agent KH-560 and TEOS were chosen as raw materials. The prepared E-SiO2 were then used as fillers to blend with EP (E-51). The ring opening reactions of epoxy groups on the E-SiO2 and EP were happened under the presence of curing agent, to obtain the E-SiO2/EP composites with interpenetrating network structure which connected by chemical bond between organic EP and inorganic E-SiO2 fillers. The effects of E-SiO2 content on the curing reaction process and comprehensive performance of EP resin are also researched. This work is aiming to prepare a new kind of E-SiO2/EP composites that can be used in high frequency circuit.
杨菊香, 贾园, 马文建, 李朋娜, 屈颖娟. 互穿网络结构的二氧化硅/环氧树脂复合材料的制备及介电性能研究[J]. 材料导报, 2024, 38(5): 22080082-6.
YANG Juxiang, JIA Yuan, MA Wenjian, LI Pengna, QU Yingjuan. Preparation of Silicon Dioxide/Epoxy Composites with Interpenetrating Network Structure and Research on Their Dielectric Properties. Materials Reports, 2024, 38(5): 22080082-6.
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2024, Vol. 38 
