Microstructure,Solidification Process and Interface Reaction with Alumina of the Cu7-xNixTi3 Alloys
CAI Yilin1, WU Changjun1,2,*, LIU Ya1,2, ZHU Xiangying1,2, SU Xuping1,2
1 Key Laboratory of Materials Surface Science and Technology of Jiangsu Province Higher Education Institutes, Changzhou University, Changzhou 213164, Jiangsu, China 2 Jiangsu Collaborative Innovation Center of Photovoltaic Science and Engineering, Changzhou University, Changzhou 213164, Jiangsu, China
Abstract: To develop high-performance and low-cost Cu-Ti based brazing filler materials, the effect of Ni content on the as-cast microstructure and soli-dification process of the Cu7-xNixTi3 alloys and their interface reaction with alumina were investigated in the present work. It was found that all the Cu7-xNixTi3 alloys with addition (atomic fraction) of 20%—50% Ni are mainly composed of uniformly precipitated τ1-CuNiTi phase. Ni content in the τ1 phase increases with it in the alloy. At the same time, the FCC and Cu4Ti phases, which exists in alloys with 20%—30% Ni, gra-dually decrease until they disappeared, and the alloy hardness gradually increases. When Ni content is ≥40%, the τ6-CuNi2Ti phase appears and gradually increases in the alloy. Furthermore, the increase of Ni content raises the melting point of Cu7-xNixTi3 alloys to 1 187 ℃, but shor-tens the melting range to 35 ℃. After melting at 1 200 ℃, the liquid Cu7-xNixTi3 alloy has good wettability with alumina. When 20%—30% Ni is added, a continuous TiO2 and Ni2TiO reaction layer with moderate thickness forms at the reacted interface. These findings will provide a theoretical basis for designing economical Cu-Ni-Ti based brazing filler materials.
蔡易霖, 吴长军, 刘亚, 朱翔鹰, 苏旭平. Cu7-xNixTi3合金显微组织、凝固过程及与氧化铝的界面反应[J]. 材料导报, 2026, 40(3): 25010159-7.
CAI Yilin, WU Changjun, LIU Ya, ZHU Xiangying, SU Xuping. Microstructure,Solidification Process and Interface Reaction with Alumina of the Cu7-xNixTi3 Alloys. Materials Reports, 2026, 40(3): 25010159-7.
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2026, Vol. 40 
