Abstract: The copper-coated mesophase pitch-based carbon fibers (Cu-CF) were prepared by electroless copper plating for improving the conductivity of CF, and the Cu-CF reinforced ABS resin (Cu-CF/ABS) composites were prepared using hot-pressed method. The surface morphology and microcrystalline structure of Cu-CF were characterized by SEM, EDS and XRD. The relationship between the thickness of copper layers as well as the interface structure of Cu-CF and the conductivity of composites was investigated. The results showed that the electroless copper plating was a grain size growing and crystal structure compacting process for achieving copper layers on the surface of carbon fiber. The resistivity of the Cu-CF decreased rapidly as increasing the thickness of copper layers, and the resistivity of the Cu-CF slowed to a constant level when the thickness of copper layers over 695 nm. Moreover, the Cu-CF/ABS composites presented excellent conductivity of 5.87×10-4 Ω·cm when the resultant Cu-CF (thickness of 632 nm) used as strengthening phases with volume fraction of 20%. Therefore, the Cu-CF/ABS composites showed a great potential application for conductive functional materials.
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2018, Vol. 32 
