Research Progress on the Alloying of Sn-Zn Lead-free Solder
LI Fang1,2, LI Caiju1,2,*, PENG Jubo3,*, YI Jianhong1,2, GAO Peng1,2, ZHANG Jiatao3, GUAN Hongda1,2, GUAN Yifan1,2
1 Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China 2 Institute of Material Genome Engineering, Kunming University of Science and Technology, Kunming 650093, China 3 Research and Development Center, Yunnan Tin Group (Holding) Company Limited, Kunming 650106, China
Abstract: Owing to the merits of similar eutectic melting point to the traditional Sn-Pb solders, compatibility with existing technology, and low cost etc., the Sn-Zn lead-free solders have been considered as one of the most promising alternatives for the conventional Sn-Pb solders. However, the Sn-Zn lead-free solder has problems such as poor wettability, oxidation resistance and corrosion resistance, which limit its practical engineering application. Studies have shown that alloying is an effective way to improve the performance of Sn-Zn lead-free solders. In order to improve the wettability, oxidation resistance, corrosion resistance, mechanical properties and creep resistance of Sn-Zn solder, researchers have proposed different methods and solutions. Addressing the problem of poor wettability of Sn-Zn solders, alloying methods are mainly used to reduce its surface tension and suppress the formation of Cu-Sn intermetallic compounds at the interface. To improve the oxidation resistance of Sn-Zn solders, on the one hand, elements more active than Zn can be added to react preferentially with O2 and then form a dense oxide protective film; on the other hand, a certain amount of alloying element can be added to the solder to form oxidation resistant phases with Sn or Zn. In addition, the passivation effect of corrosion products, the morphology of Zn-rich phase and the corrosion diffusion behavior of Zn-rich phase can be optimized by alloying method, so as to enhance the corrosion resistance of Sn-Zn solder. The mechanical properties of Sn-Zn solders are mainly improved by means of fine grain strengthening, second phase strengthening and solid solution strengthening, while the creep resistance of solders can be improved by adding a certain amount of Ni, Sb, RE and other elements. This paper summarized the latest research progress in the alloying of Sn-Zn lead-free solders systematically. Furthermore, the difficulties and challenges about the studies on Sn-Zn lead-free solders were analyzed, and its future development prospects were prospected. The purpose of this paper is to provide some references for the preparation of high-performance Sn-Zn lead-free solders.
作者简介: 李芳,2017年6月毕业于辽宁工业大学,获得工学学士学位。2020年7月毕业于昆明理工大学,获得硕士学位。目前主要研究领域为锡锌系无铅钎料合金化研究。 李才巨,博士,昆明理工大学材料科学与工程学院教授、博士研究生导师。2000年7月本科毕业于昆明理工大学金属压力加工专业,2003年7月硕士毕业于清华大学材料学专业,2014年7月在昆明理工大学材料学专业取得博士学位。主要从事金属基复合材料、材料基因工程与无铅锡基钎料等先进金属材料研究工作。近年来,在Carbon、Applied Physics Letter、Scripta Materialia、Materials Science and Engineering A等国内外学术期刊发表论文100余篇。 彭巨擘,博士,云南锡业集团(控股)有限责任公司正高级工程师、博士研究生导师,主要从事金属材料、高纯材料、材料基因工程等方面研究工作。1997年本科毕业于华东理工大学无机材料专业,2005年获昆明理工大学材料学硕士学位,2010年获材料学工学博士学位(昆明理工大学& Max-Planck Institute for Solid State Research联合培养博士)。近年来,在国内外学术期刊上发表文章30多篇,获授权发明专利12件。
引用本文:
李芳, 李才巨, 彭巨擘, 易健宏, 高鹏, 张家涛, 关洪达, 关一凡. 锡锌系无铅钎料合金化研究进展[J]. 材料导报, 2022, 36(13): 20010038-10.
LI Fang, LI Caiju, PENG Jubo, YI Jianhong, GAO Peng, ZHANG Jiatao, GUAN Hongda, GUAN Yifan. Research Progress on the Alloying of Sn-Zn Lead-free Solder. Materials Reports, 2022, 36(13): 20010038-10.
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2022, Vol. 36 
