Effects of Sc Content and Heat Treatment on Microstructure and Thermal Properties of Al-Si-Cu-Mg Alloy
XU Shengliang1, LIAO Kai1, YANG Xiangjie1,*, GUO Hongmin2
1 School of Advanced Manufacturing, Nanchang University, Nanchang 330031, China 2 School of Physics and Materials Science, Nanchang University, Nanchang 330031, China
Abstract: With the advancement of communication, unmanned driving, and other technological fields, the integration of electronic devices has been continuously enhanced, resulting in elevated demands for the performance of electronic packaging materials. In this work, the impact of Sc content and heat treatment on the microstructure and thermal properties of Al-Si-Cu-Mg alloy was thoroughly investigated. The primary objective was to identify the optimal Sc addition and heat treatment procedure for producing the Al-Si alloy with reduced expansion and increased thermal conductivity. The findings reveal that the inclusion of Sc effectively refines the primary silicon phase and eutectic silicon phase in Al-20Si-2Cu-0.3Mg alloy, consequently leading to a gradual decline in the thermal expansion coefficient of the alloy. Subsequent heat treatment further optimizes the eutectic silicon morphology, resulting in an alloy with diminished thermal expansion coefficient, heightened thermal conductivity, and electrical conductivity. Within the temperature range of 30 to 300 ℃, the average thermal expansion coefficient, thermal conductivity, and conductivity of Al-20Si-2Cu-0.3Mg-0.2Sc alloy are 17.58×10-6 K-1, 131.05 W/(m·K), and 22.07% IACS, respectively. This study extensively discusses the impact of Sc content and heat treatment on the microstructure of Al-Si-Cu-Mg alloy, contributing to a comprehensive understanding of the relationship between microstructure and thermal properties. The insights gained from this work may offer valuable guidance for the development of Al-Si alloys characterized by low expansion and superior thermal conductivity.
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2025, Vol. 39 
