A Brief Introduction of the ‘More than Moore Era' Chip Interconnection Method
ZHANG Shuye1,2,*, CHU Yuanfan1, LI Zhenfeng1, BAO Junhui1, ZHANG Yuyang1, LIU Yifu1, YI Qinghong1, CUI Lanxin1, HE Peng1,*
1 State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150000, China 2 Key Laboratory of Science and Technology on Silicon Devices, Chinese Academy of Sciences, Beijing 100000, China
Abstract: With the semiconductor process approaching its physical limit, the semiconductor industry has gradually entered the ‘More than Moore era'. Integrated technology is an important way to continue to improve the performance of electronic products. The key technologies to achieve high integration all require smaller size connections. With the decrease of connection size, the failure of devices at service temperature is beco-ming more and more serious due to the influence of the connection process on the package. Interconnection is an important way of chip heat conduction. Micro nano connection technology with high thermal conductivity and low process impact is expected to solve the reliability problem of high-power density devices. This paper summarizes the development of micro nano connection technology in new solders and energy transfer methods, briefly introduces the surface activation technology and discusses the possibility of its application in electronic packaging, and on this basis, briefly discusses the development direction of micro nano connection technology.
通讯作者:
* 张墅野,哈尔滨工业大学电子封装技术专业副教授、博士研究生导师。2012年哈尔滨工业大学电子封装技术专业本科毕业,2014年KAIST韩国先进科学技术院硕士毕业,2017年KAIST韩国先进科学技术院材料科学与工程专业博士毕业。2020年至今于哈尔滨工业大学电子封装技术专业任副教授。目前主要从事先进电子封装、光烧结柔性印刷电子技术、先进纳米材料与高端电子器件系统集成与封装方面的研究工作。发表SCI/EI文章61篇,包括Nano Energy、Progress in Natural Science-Materials International等。获2020年中国机械工业科学技术奖科技进步类特等奖、2019年中国机械工业科学技术科技进步三等奖、2020年中国产学研合作创新成果二等奖。syzhang@hit.edu.cn;何鹏,哈尔滨工业大学电子封装技术专业教授、博士研究生导师。1995年哈尔滨工业大学金属材料及工艺系本科毕业,1997年哈尔滨工业大学硕士毕业,2001年哈尔滨工业大学材料科学与工程学院博士毕业。2008至今任哈尔滨工业大学先进焊接与连接国家重点实验室教授、博士生导师。目前主要从事钎焊、微连接、连接界面行为与控制的基础理论与实际应用技术研究。主持和参加国家自然基金、国家973、863等课题20余项。获教育部自然科学奖一等奖1项,授权国家发明专利52项;已发表论文500余篇。nanojoin@hit.edu.cn
引用本文:
张墅野, 初远帆, 李振锋, 鲍俊辉, 张雨杨, 刘一甫, 易庆鸿, 崔澜馨, 何鹏. “后摩尔时代”芯片互连方法简析[J]. 材料导报, 2023, 37(15): 22040268-10.
ZHANG Shuye, CHU Yuanfan, LI Zhenfeng, BAO Junhui, ZHANG Yuyang, LIU Yifu, YI Qinghong, CUI Lanxin, HE Peng. A Brief Introduction of the ‘More than Moore Era' Chip Interconnection Method. Materials Reports, 2023, 37(15): 22040268-10.
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2023, Vol. 37 
