Influence of Glass Powder Systems on Performance of Copper-based Electrode Paste for MLCC
JIN Xuechang1, GAO Jun2, LI Yan2, CHEN Jiangjun2, LIU Chunjing2, ZHAO Ning1
1 School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China 2 Dalian Overseas Huasheng Electronic Technology Co., Ltd., Dalian 116023, China
Abstract: Multilayer Ceramic Capacitors (MLCC) are widely used in the fields of electronics, communications, aerospace, etc. And copper terminal electrode plays a key role in the performance of MLCC. This paper explored the influence of glass powder systems on the structure and performance of copper terminal electrode. The effects of glass systems with different sizes on the microstructure and acid resistance of the copper terminal electrode were analyzed in detail. The conclusions are as followed. A thick transition layer was formed at the interface between the terminal electrode prepared by ZnO-B2O3-SiO2 glass powder system and the ceramic body after sintering, improved the adhesion of the terminal electrode on the ceramic body. While the glass bubbles formed on the surface of the terminal electrode were harmful for the subsequent electroplating process. And a thicker transition layer was formed at the interface after sintering with more glass bubbles appeared on the surface of the terminal electrode by reducing the size of the ZnO-B2O3-SiO2 glass powder. Then the ZnO-B2O3-SiO2 glass powder slurry with a 1.5 μm size (D50) mo-dified by adding a certain amount of BaO-ZnO-B2O3 glass powder system resulted the glass bubbles on the sintered surface disappeared after etching by plating solutions, which is beneficial to achieve a uniform coating on the terminal electrode for electroplating, and more suitable for the copper paste of terminal electrode.