Abstract: Response surface methodology (RSM) was used to optimize the preparation parameters of paraffin microcapsules and the prediction model was established to determine the optimal process conditions. Scanning electron microscopy (SEM), differential calorimetry (DSC), thermal conductivity tester and thermogravimetric analyzer (TG) were used to optimize the morphology, chemical structure, coating properties, thermal properties and stability of paraffin phase change microcapsules prepared under the optimized process conditions. The results showed that the microcapsules were spherical, smooth and slightly adhered. The encapsulation performance was good and the content of core material was 75.77wt%. The latent heat of microcapsules was 105.93 J/g and the thermal conductivity was 0.152 6 W/(m·K). The thermal decomposition temperature of microcapsules was increased to over 300 ℃.The volume of microcapsules remained unchanged when the temperature of microcapsules was raised to above the melting point. It demonstrated that microencapsulation could significantly enhance thermal stability and volume stability of paraffin.
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2019, Vol. 33 
