稀土元素对微电子封装互连材料组织与性能的影响

doi:10.11896/cldb.24030246

材料导报

2025, Vol. 39

Issue (12): 24030246-9 https://doi.org/10.11896/cldb.24030246

金属与金属基复合材料

稀土元素对微电子封装互连材料组织与性能的影响

苏子龙^1,2, 尹立孟^1,3,4,*, 陈玉华⁵, 张鹤鹤⁴, 张龙⁴, 张丽萍^4,6

1 新疆大学机械工程学院,乌鲁木齐 830049
2 北京中科新微特科技开发股份有限公司,北京 100012
3 重庆三峡学院机械工程学院,重庆 404020
4 重庆科技大学机械与智能制造学院,重庆 401331
5 南昌航空大学材料科学与工程学院,南昌 330063
6 北京航空航天大学材料科学与工程学院,北京 100191

Effect of Rare Earth Elements on Microstructure and Properties of Interconnected Materials for Microelectronic Packaging

SU Zilong^1,2, YIN Limeng^1,3,4,*, CHEN Yuhua⁵, ZHANG Hehe⁴, ZHANG Long⁴, ZHANG Liping^4,6

1 School of Mechanical Engineering, Xinjiang University, Urumqi 830049, China
2 Beijing Zhongke New Micro Technology Development Co., Ltd., Beijing 100012, China
3 School of Mechanical Engineering, Chongqing Three Gorges University, Chongqing 404020, China
4 School of Mechanical and Intelligent Manufacturing, Chongqing University of Science & Technology, Chongqing 401331, China
5 School of Materials Science and Engineering, Nanchang Hangkong University, Nanchang 330063, China
6 School of Materials Science and Engineering, Beihang University, Beijing 100191, China

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摘要随着微电子封装无铅化的发展,封装互连材料的综合性能需要进一步提升。通过合金化改性来提升材料性能是一种行之有效的方法,在合金化改性中稀土材料发挥了极其重要的作用。本文重点介绍了稀土元素对电子封装互连材料的影响,主要总结讨论了添加不同种类和不同含量的稀土元素对Au、Cu和Ag键合引线,SnAgCu系、SnZn系和Sn-Bi系等无铅钎料,Sn-Ce镀层和Sn-RE合金显微组织与力学性能的影响,最后总结了稀土元素在微电子封装互连材料中发挥的作用以及存在的不足,并对电子封装互连材料中添加微量稀土元素的研究进行了展望。

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	苏子龙
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	张丽萍

关键词: 稀土元素电子封装互连材料键合引线无铅钎料锡基镀层/合金显微组织力学性能

Abstract: With the development of lead-free microelectronic packaging, the comprehensive properties of packaging interconnected materials need to be further improved. It is an effective method to enhance the properties of materials by alloying modification, and rare earth materials play an important role in alloying modification. This paper focuses on the effects of rare earth elements on interconnected electronic packaging materials. The effects of rare earth elements on the microstructure and properties of Au, Cu, and Ag bonding wires, SnAgCu, SnZn and other lead-free solders, Sn-Ce coating, and Sn-RE alloy are summarized and discussed. Finally, the roles and shortcomings of rare earth elements in microelectronic packaging interconnection materials are summarized, and the research on adding trace rare earth elements in electronic packaging interconnect materials is prospected.

Key words: rare earth element electronic packaging interconnected material bond wire lead free solder tin coating/alloy microstructure mechanical property

出版日期: 2025-06-25 发布日期: 2025-06-19

ZTFLH:

TB31

基金资助: 国家自然科学基金(52175288;U24A20117);重庆市自然科学基金创新发展联合基金重点项目(CSTB2023NSCQ-LZX0002);新疆大学优秀研究生创新项目(XJDX2025YJS093)

通讯作者: ^*尹立孟,博士,新疆大学、重庆三峡学院、重庆科技大学教授,博士研究生导师。目前主要从事先进焊接与微连接理论及技术、电子封装材料和可靠性等方面的研究。yeenlm@cqust.edu.cn

作者简介: 苏子龙,博士研究生。目前主要从事电子封装材料及其可靠性研究。

引用本文:

苏子龙, 尹立孟, 陈玉华, 张鹤鹤, 张龙, 张丽萍. 稀土元素对微电子封装互连材料组织与性能的影响[J]. 材料导报, 2025, 39(12): 24030246-9.
SU Zilong, YIN Limeng, CHEN Yuhua, ZHANG Hehe, ZHANG Long, ZHANG Liping. Effect of Rare Earth Elements on Microstructure and Properties of Interconnected Materials for Microelectronic Packaging. Materials Reports, 2025, 39(12): 24030246-9.

链接本文:

https://www.mater-rep.com/CN/10.11896/cldb.24030246 或 https://www.mater-rep.com/CN/Y2025/V39/I12/24030246

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