Abstract: In this work, two types of AlN/epoxy resin (AlN/EP) composites were prepared by mechanical blending of near-spherical AlN (AlNP) powder and particle/whisker hybrid AlN (AlNH) powder as fillers, respectively, and KH560 silane coupling agent as surface modifier. The effects of KH560 concentration, filler loading, and filler morphology on the microstructure and thermal conductivity of the composites were syste-matically investigated. The results indicated that when the concentration of KH560 was 1wt%, the modification effect of AlN filler reached its optimum. As the filler loading increased, effective thermal pathways gradually formed in the epoxy resin matrix, thereby enhancing the thermal conductivity of the composites. Compared with AlNP filler, AlNH filler showed a stronger tendency to form a thermal network within the matrix, resulting in a superior thermal conductivity of the composites. However, when the AlNH loading was excessively high, the whiskers tended to agglo-merate and form defects, which led to the increase of thermal resistance and the decrease of thermal conductivity. When the AlNP loading was 60%, the thermal conductivity of the composite reached 1.22 W·m-1·K-1; while at 50wt% AlNH loading, the thermal conductivity was 0.613 W·m-1·K-1. Furthermore, the thermal conduction mechanisms of the AlN/EP composites were analyzed based on theoretical thermal conduction models and finite element simulations.
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2026, Vol. 40 
