基于硅/二维层状材料异质结的红外光电探测器研究进展

doi:10.11896/cldb.22030194

材料导报

2024, Vol. 38

Issue (1): 22030194-9 https://doi.org/10.11896/cldb.22030194

无机非金属及其复合材料

基于硅/二维层状材料异质结的红外光电探测器研究进展

贺亦菲¹, 杨德仁^1,2, 皮孝东^1,2,*

1 浙江大学材料科学与工程学院硅材料国家重点实验室,杭州 310027
2 浙江大学杭州国际科创中心,杭州311200

Research Progress on Heterojunction Infrared Photodetectors Based on Silicon/Two-dimensional Layered Materials

HE Yifei¹, YANG Deren^1,2, PI Xiaodong^1,2,*

1 State Key Laboratory of Silicon Materials, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China
2 Hangzhou Global Scientific and Technological Innovation Center, Zhejiang University, Hangzhou 311200, China

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摘要红外光是一种频率介于微波和可见光范围之间的电磁波,在光通信、人工智能、医用治疗、军事探测和航空航天等领域具有广泛的应用。硅的带隙为1.12 eV,导致硅基光电探测器的截止波长短(约1.1 mm)。近年来,研究发现了新型二维层状材料,它们具有带隙可调、载流子迁移率高、光谱响应宽、暗电流低、稳定性高以及制备工艺与互补金属氧化物半导体(Complementary metal oxide semiconductor,CMOS)工艺兼容等诸多优点,引起了研究人员的广泛关注。通过将硅与二维层状材料结合,能够有效地将硅基光电探测器的探测波段向波长超过1.1 mm的红外光波段拓展。本文着重介绍了近年来可探测波长超过传统硅光电探测器的基于硅/二维层状材料异质结的光电探测器在近红外和中红外光波段的研究进展并展望了其发展前景。

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关键词: 硅二维层状材料异质结红外光电探测器

Abstract: Infrared light, an electromagnetic wave with a frequency range that lies between that of microwave and visible light, is widely used in the fields of optical communication, artificial intelligence, medical treatment, military detection, and aerospace. Infrared light is difficult to detect because it is invisible to the human eye. The cutoff wavelength (about 1.1 mm) of silicon-based photodetectors are limited by the bandgap of silicon (about 1.12 eV). In recent years, researchers have discovered novel two-dimensional layered materials with a tunable bandgap, high carrier mobility, wide spectral response, low dark current, and high stability. Additionally, their micro-nano processing technology is compatible with CMOS technology. Combining silicon with two-dimensional layered materials can efficiently expand the detection band of silicon photodetectors to the infrared light band with wavelengths exceeding 1.1 mm. In this review, we focus on the current reports related to silicon/two-dimensional layered materials heterojunctions. We introduce the application of silicon heterojunction infrared photodetectors with two-dimensional materials, such graphene, black phosphorus, and two-dimensional transition metal chalcogenides; we also present the performance of these devices. Finally, based on recent research, the outlook on heterojunction infrared photodetectors based on silicon/two-dimensional layered material is presented. It is believed that heterojunction infrared photodetectors based on silicon/two-dimensional material have the potential to realize advanced applications in the future.

Key words: silicon two-dimensional layered material heterojunction infrared photodetector

发布日期: 2024-01-16

ZTFLH:

TN215

通讯作者: 皮孝东,浙江大学材料科学与工程学院、硅材料国家重点实验室和浙江大学杭州国际科创中心先进半导体研究室教授、博士研究生导师。1997年武汉理工大学材料科学与工程学院本科毕业,2000年浙江大学材料科学与工程学院硕士毕业,2004年英国巴斯大学物理系博士毕业后先后于加拿大麦克马斯特大学、美国明尼苏达大学开展研究工作。2008年进入浙江大学材料科学与工程学院和硅材料国家重点实验室工作至今。目前主要从事硅基光电子材料与器件、硅基光增益纳米结构材料与器件、表面等离激元高效光热转换机理、器件及太阳能利用等方面的研究工作。在Advanced Materials、Nano Energy、ACS Nano、Nano Letters、Advanced Functional Materials等期刊上发表过文章。xdpi@zju.edu.cn

作者简介: 贺亦菲,2019年6月于四川大学获得工学学士学位,2022年6月毕业于浙江大学材料学院硅材料国家重点实验室,获硕士学位,在皮孝东教授的指导下进行研究。主要研究领域为硅基二维材料光电探测器。

引用本文:

贺亦菲, 杨德仁, 皮孝东. 基于硅/二维层状材料异质结的红外光电探测器研究进展[J]. 材料导报, 2024, 38(1): 22030194-9.
HE Yifei, YANG Deren, PI Xiaodong. Research Progress on Heterojunction Infrared Photodetectors Based on Silicon/Two-dimensional Layered Materials. Materials Reports, 2024, 38(1): 22030194-9.

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http://www.mater-rep.com/CN/10.11896/cldb.22030194 或 http://www.mater-rep.com/CN/Y2024/V38/I1/22030194

1 Gan X T, Shiue R J, Gao Y D, et al. Nature Photonics, 2013, 7, 883.
2 Shiue R J, Gao Y D, Wang Y F, et al. Nano Letters, 2015, 15, 7288.
3 Yao Y, Shankar R, Rauter P, et al. Nano Letters, 2014, 14, 3749.
4 Ni Z Y, Ma L L, Du S C, et al. ACS Nano, 2017, 11, 9854.
5 Wei J X, Li Y, Wang L, et al. Nature Communications, 2020, 11, 6404.
6 Xia F N, Wang H, Jia Y C. Nature Communications, 2014, 5, 4458.
7 Guo Q S, Pospischil A, Bhuiyan M, et al. Nano Letters, 2016, 16, 4648.
8 Deckoff-Jones S, Lin H T, Kita D, et al. Journal of Optics, 2018, 20, 044004.
9 Buscema M, Groenendijk D J, Blanter S I, et al. Nano Letters, 2014, 14, 3347.
10 Venuthurumilli P K, Ye P D, Xu X F. ACS Nano, 2018, 12, 4861.
11 Zhang Y S, Wang S W, Chen S L, et al. Advanced Materials, 2020, 32, e1808319.
12 Xiao P, Mao J, Ding K, et al. Advanced Materials, 2018, 30, 1801729.
13 Wang Z Y, Zhang X W, Wu D, et al. Journal of Materials Chemistry C, 2020, 8, 6877.
14 Zhao Y D, Qiao J S, Yu Z H, et al. Advanced Materials, 2017, 29, 1604230.
15 Wu D, Guo J W, Du J, et al. ACS Nano, 2019, 13, 9907.
16 Liang Q J, Wang Q X, Zhang Q, et al. Advanced Materials, 2019, 31, 1260.
17 Zhao Y, Qiao J S, Yu P, et al. Advanced Materials, 2016, 28, 2399.
18 Dong Z, Yu W Z, Zhang L B, et al. ACS Nano, 2021, 15(12), 20403.
19 Wang Y, Li Y F, Chen Z F. Journal of Materials Chemistry C, 2015, 3, 9603.
20 Oyedele A D, Yang S Z, Feng T L, et al. Journal of the American Che-mical Society, 2019, 141, 8928.
21 Li G, Yin S Q, Tan C Y, et al. Advanced Functional Materials, 2021, 31, 2104787.
22 Oyedele A D, Yang S Z, Liang L B, et al. Journal of the American Chemical Society, 2017, 139, 14090.
23 Venkatesan A, Rathi S, Kim Y, et al. Materials Science in Semiconductor Processing, 2020, 115, 105102.
24 Wang C X, Dong Y, Lu Z J, et al. Sensors and Actuators A: Physical, 2019, 291, 87.
25 Wang Y X, Qiu G, Wang R X, et al. Nature Electronics, 2018, 1, 228.
26 Wang X M, Cheng Z Z, Xu K, et al. Nature Photonics, 2013, 7, 888.
27 Goykhman I, Sassi U, Desiatov B, et al. Nano Letters, 2016, 16, 3005.
28 Casalino M, Sassi U, Goykhman I, et al. ACS Nano, 2017, 11, 10955.
29 Jana S, Mukherjee S, Bhaktha B N S, et al. ACS Applied Materials & Interfaces, 2022, 14, 1699.
30 Yuan L, Chung T F, Kuc A, et al. Science Advances, 2019, 4, e1700324.
31 Zhou Y Q, Tan H J, Sheng Y W, et al. ACS Nano, 2018, 12, 4669.
32 Wu E P, Wu D, Jia C, et al. ACS Photonics, 2019, 6, 565.
33 Mao J, Yu Y Q, Wang L, et al. Advanced Science, 2016, 3, 1600018.
34 Lu Z J, Xu Y, Yu Y Q, et al. Advanced Functional Materials, 2020, 30, 1907951.
35 Nidhi, Jakhar A, Uddin W, et al. ACS Applied Nano Material, 2020, 3, 9401.
36 Zeng L H, Wu D, Jie J S, et al. Advanced Materials, 2020, 32(52), 2004412.
37 Wu D, Jia C, Shi F H, et al. Journal of Materials Chemistry A, 2020, 8, 3632.
38 Wu D, Guo J W, Du J, et al. ACS Nano, 2019, 13, 9907.
39 Lu J T, Zheng Z Q, Yao J D, et al. Small, 2019, 15, 1904912.
40 Du S C, Ni Z Y, Liu X M, et al. In: 2017 IEEE International Electron Devices Meeting (IEDM). San Francisco, 2017, pp.233.
41 He T Y, Lan C Y, Zhou S H, et al. Journal of Materials Chemistry C, 2021, 9, 3846.
42 Cao Y, Zhu J X, Xu J, et al. Small, 2014, 10, 2345.
43 Wu D, Guo C G, Wang Z Y, et al. Nanoscale, 2021, 13, 13550.
44 John J W, Dhyani V, Maity S, et al. Nanotechnology, 2020, 31, 455208.
45 Aftab S, Samiya M, Liao W G, et al. Journal of Materials Chemistry C, 2021, 9, 3998.
46 Zeng L H, Lin S H, Lou Z H, et al. NPG Asia Materials, 2018, 10, 352.
47 Liang F X, Zhao X Y, Jiang J J, et al. Small, 2019, 15, 1903831.
48 Zhou S, Pi X D, Ni Z Y, et al. ACS Nano, 2015, 9, 378.
49 Yu T, Wang F, Xu Y, et al. Advanced Materials, 2016, 28, 4912.
50 Nguyen-Huu N, Cada M, Ma Y, et al. Journal of Physics D: Applied Physics, 2017, 50, 205105.
51 Wang A H, Hsu P F, Chen Y B, et al. Science China Technological Sciences, 2010, 53, 2207.
52 Low T, Avouris P. ACS Nano, 2014, 8, 1086.
53 Fang Z Y, Liu Z, Wang Y M, et al. Nano Letters, 2012, 12, 3808.
54 Youngblood N, Chen C, Koester S J, et al. Nature Photonics, 2015, 9, 247.
55 Connolly C. Assembly Automation, 2005, 25, 191.
56 Wu P S, He T, Zhu H, et al. InfoMat, 2022, 4, e12275.
57 Liao K H, Lei P X, Tu M L, et al. ACS Applied Materials & Interfaces, 2021, 13, 32606.
58 Seo S, Lee J J, Lee H J, et al. ACS Applied Electronic Materials, 2020, 2, 371.
59 Lee G, Baek J H, Ren F, et al. Small, 2021, 17, 2100640.
60 Wang S Y, Zhang D W, Zhou P. Science Bulletin, 2019, 64, 1056.

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