Preparation and Performance Analysis of Gel-forming Diamond Abrasive Polishing Disc for Polishing SiC Wafer
FENG Kaiping1,2, LYU Binghai2, WANG Shuai3, ZHAO Tianchen1, ZHOU Zhaozhong1
1 School of Mechanical Engineering, Quzhou University, Quzhou 324000,Zhejiang, China 2 School of Mechanical Engineering, Zhejiang University of Technology,Hangzhou 310014, China 3 School of Mechanical Engineering, Zhejiang University,Hangzhou 310012, China
Abstract: To solve the problem that ultrafine diamond powder polishing disc using hot pressing method is easy to produce deep scratch on the surface of SiC wafer, a preparation method of ultrafine diamond powder fixed abrasive polishing disc based on polyvinyl alcohol freezing and thawing gel-forming mechanism is proposed. The properties of the gel polishing disc were characterized by mechanical property tests, infrared spectrum, friction wear and thermogravimetric analysis. The results show that when the polyvinyl alcohol content is greater than 3wt%, the polyvinyl alcohol-phenolic resin mixed glue can form a complete gel. When the polyvinyl alcohol content is 5wt%—6wt%, a large number of capillary micropores are formed in the gel polishing disc, the pores are interlaced and interlinked, the gel polishing disc has the highest flexural strength and tensile strength, the highest average friction coefficient, and the best stability of friction coefficient, the uniformity of abrasives is better than that of the hot pressing polishing disc. With the increase of polyvinyl alcohol content, the surface of the gel polishing disc is covered by resin bond, and the plasticity of the gel polishing disc becomes larger, the effect of polyvinyl alcohol pyrolysis on the friction coefficient of the gel polishing disc increases, and the friction coefficient begins to reduce with the increase of friction time. The polishing contrast experiment showed that when the SiC wafer was polished by the gel polishing disc with a polyvinyl alcohol content of 5wt%, the average surface roughness Ra less than 2.5 nm was obtained. After the next chemical mechanical polishing (CMP) process, the surface roughness Ra less than 0.5 nm was obtained, and the polishing effect was better than that of the hot pressing polishing disc.
1 Yang X, Sun R Y, Ohkubo Y, et al. Electrochimica Acta, 2018, 271, 666. 2 Lu J, Wang Y G, Luo Q F, et al. Precision Engineering, 2017, 49, 235. 3 Ji J W, Kazuya Y, Deng H. Acta Physica Sinica, 2021, 70(6), 068102 (in Chinese). 吉建伟, 山村和也, 邓辉. 物理学报, 2021, 70(6), 068102. 4 Lu J, Luo Q F, Mao X Y, et al. Precision Engineering. 2017, 47, 353. 5 Wang J H, Deng Q F, Yuan J L, et al. Surface Technology, 2020, 49(6), 314 (in Chinese). 王佳焕, 邓乾发, 袁巨龙, 等. 表面技术, 2020, 49(6), 314. 6 Huang S G, Lu J, Lin Y C, et al. Journal of Sol-gel Science and Techno-logy, 2020, 96, 314. 7 Huo F W, Zhao H H, Zhao D J. Materials and Manufacturing Processes, 2011, 8, 977. 8 Chandra A, Karra P, Bastawros A F, et al. CIRP Annals-Manufacturing Technology, 2008, 57 (1), 559. 9 Kwon T Y, Cho B J, Ramachandran M, et al. Tribology Letters, 2013, 50(2), 169. 10 Ring T A, Feeney P, Boldridge D, et al. Journal of the Electrochemical Society, 2007, 154(3), 239. 11 Suratwala T, Steele R, Feit M D, et al. Journal of Non-Crystalline So-lids, 2007, 354 (18), 2023. 12 Hao S L, Wang X, Cui Y F, et al. Journal of Synthetic Crystals, 2006, 35(2), 342 (in Chinese). 郝顺利, 王新, 崔银芳, 等. 人工晶体学报, 2006, 35(2), 342. 13 Liu H K, Chen C C A, Chen W C. The International Journal of Advanced Manufacturing Technology, 2020, 106(11-12), 4755. 14 Lin Y C, Lu J, Tong R L, et al. Diamond and Related Materials, 2018, 83, 46. 15 Lu J, Luo Q F, Song Y Y, et al. Chinese Journal of Mechanical Enginee-ring, 2015, 51(15), 205(in Chinese). 陆静, 罗求发, 宋运运, 等. 机械工程学报, 2015, 51(15), 205. 16 Zhang J, Zhang B G, Zhou X J, et al. Journal of Southwest Forestry University(Natural Science), 2018, 38(4), 173(in Chinese). 张俊, 张本刚, 周晓剑, 等. 西南林业大学学报(自然科学版), 2018, 38(4), 173. 17 Wu Z, Zhu Y F, Chen J P, et al. Modern Manufacturing Engineering, 2019(12), 9(in Chinese). 吴喆, 朱衍飞, 陈俊鹏, 等.现代制造工程, 2019(12), 9. 18 Wang W S, Hu Z W, Zhao H, et al. Optics and Precision Engineering, 2019, 27(1), 69(in Chinese). 王文珊, 胡中伟, 赵欢, 等. 光学精密工程, 2019, 27(1), 69. 19 Yu Y Q, Hu Z W, Wang W S, et al. International Journal of Advanced Manufacturing Technology, 2020, 4, 997 . 20 Wang R, Zhang J H, Chen S Y, et al. Composites Part B: Engineering , 2019, 177, 107383. 21 Li X M, Liu C J, Chen W M, et al. Acta Polymerica Sinica, 1989(5), 519(in Chinese). 李希明, 刘成杰, 陈文明, 等. 高分子学报, 1989(5), 519. 22 Wu L G, Hu S H, Zhang Y T, et al. New Chemical Materials, 2001, 29(11), 18(in Chinese). 吴李国, 胡绍华, 章悦庭, 等. 化工新型材料, 2001, 29(11), 18. 23 Gong G S, Liu J B, Zhong Y P, et al. Chemical Industry and Engineering Progress, 2016, 35(8), 2507(in Chinese). 龚桂胜, 刘景勃, 钟玉鹏, 等. 化工进展, 2016, 35(8), 2507. 24 Chen L Q, Zhang D K, Zhang J S, et al. Journal of Clinical Rehabilitative Tissue Engineering Research, 2007, 11(48), 9679(in Chinese). 陈立奇, 张德坤, 张劲松, 等. 中国组织工程研究与临床康复, 2007, 11(48), 9679. 25 Meacham R, Liu M, Guo J, et al. Experimental Mechanics, 2020, 8, 1161. 26 Lozinsky V I, Kolosova O Y, Michurov D A, et al. Gels, 2018, 4(4), 81. 27 Nagahata M, Nakaoka R, Teramoto A, et al. Biomaterials, 2005, 26(25), 5138. 28 Fang Z C, Suo J P. Journal of Applied Polymer Science, 2011, 119, 744. 29 Gong R Z, Zhang L, Zhao A J, et al. Adhesion, 2004, 25(1), 36(in Chinese). 龚荣洲, 张凌, 赵爱军, 等. 粘接, 2004, 25(1), 36. 30 Zhu C S, Sun B S. Thermosetting Resin, 2010, 25(1), 23(in Chinese). 朱春山, 孙保帅. 热固性树脂, 2010, 25(1), 23. 31 Jian Y L, Yuan T S, Peng J, et al. Diamond & Abrasives Engineering, 2020, 40(5), 64(in Chinese). 简亚溜, 袁天顺, 彭进, 等. 金刚石与磨料磨具工程, 2020, 40(5), 64. 32 Huang N, Liu L, Wang X Y. Aerospace Materials and Technology, 2012(2), 99(in Chinese). 黄娜, 刘亮, 王晓叶. 宇航材料工艺, 2012(2), 99. 33 Chen H L, Yang X F, Wang S R, et al. Journal of Materials Enginee-ring, 2019, 47(6), 108(in Chinese). 陈海龙, 杨学锋, 王守仁, 等. 材料工程, 2019, 47(6), 108.