Heat Deformation Behavior and Microstructural Evolution of Lead-based Pasteurized Alloy
LIU Rui1, YANG Chuan2,*, SHI Chengcheng1,*, CUI Xuchang2, LIU Huan1, WANG Ruyue1
1 School of Mechanical Engineering, Shandong University of Technology, Zibo 255000, Shandong, China 2 Institute of Mechanical Manufacturing Technology, China Academy of Engineering Physics, Mianyang 621000, Sichuan, China
Abstract: The thermal deformation behavior of the Pb-9%Sb-2%Sn alloy at temperatures ranging from 50 ℃ to 200 ℃ and strain rates from 0.01 s-1 to 10 s-1 was investigated by thermal simulation tests, and its constitutive equation was developed. Using strain compensation to refine the equation, a thermal processing diagram was established. The microstructures of the alloy under various deformation conditions were analyzed, and combined with the thermal processing diagram, the optimal processing window for the alloy was determined, that is at temperatures ranging from 150 ℃ to 200 ℃ and strain rates from 1 s-1 to 10 s-1, and within which the precipitated phase is broken, rearranged, and uniformly distributed. The relationship between microstructural evolution and material properties during thermal deformation was also discussed.
刘瑞, 杨川, 史程程, 崔旭昌, 刘欢, 王如月. 铅基巴氏合金热变形行为与微观组织演变[J]. 材料导报, 2025, 39(22): 24090020-8.
LIU Rui, YANG Chuan, SHI Chengcheng, CUI Xuchang, LIU Huan, WANG Ruyue. Heat Deformation Behavior and Microstructural Evolution of Lead-based Pasteurized Alloy. Materials Reports, 2025, 39(22): 24090020-8.
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2025, Vol. 39 
