Research Progress in Powder Metallurgy Preparation of Tungsten-based Alloy Targets and Magnetron Sputtering Films
LI Rui1, LI Ruijian1, JIANG Hongqu1, LUO Yuan1 , ZHAO Qi2,*, YI Jianhong1, LIU Yichun1,*
1 Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China 2 Kunming Institute of Precious Metals, Kunming 650106, China
Abstract: Tungsten alloy materialhas become an important material in magnetron sputtering technology for its advantages such as high density, high purity, high melting point and excellent mechanical properties. Its preparation methods includes powder metallurgy, smelting, etc. Among which the powder metallurgy method is wide concerned with its good composition uniformity and fine microstructure. As an advanced film deposition technology, magnetron sputtering is widely used for the preparation of tungsten-based alloy films due to its high efficiency and precise control ability. The thin films of W-Mo, W-Cu, W-Ti and W-B are prepared by magnetron sputtering with tungsten base alloy as the raw material, which have been widely used in electronic devices, carbide coating and plasma physics research. In this paper, several preparation methods of tungsten-based alloy targets were introduced in detail, such as hot pressing, hot isostatic pressing, discharge plasma sintering technology. And then anti-diffusion properties, friction and wear properties, corrosion and oxidation properties of tungsten base alloy target magnetron sputtering film were analyzed, its application im many fields was introduced such as the non-diffusion barrier materials, superconducting materials, plasma-oriented materials, hard coating materials. Finally future broad development prospects in various fields was prospected.
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2025, Vol. 39 
