热电器件界面性能的研究现状

doi:10.11896/cldb.22080238

材料导报

2024, Vol. 38

Issue (6): 22080238-13 https://doi.org/10.11896/cldb.22080238

无机非金属及其复合材料

热电器件界面性能的研究现状

长俊钢, 陈玉, 何静, 梁奇银, 雷晓波, 蔡芳共^*, 张勤勇

西华大学材料科学与工程学院,成都 610036

Research Status of Interface Properties of Thermoelectric Devices

CHANG Jungang, CHEN Yu, HE Jing, LIANG Qiyin, LEI Xiaobo, CAI Fanggong^*, ZHANG Qinyong

School of Materials Science and Engineering, Xihua University, Chengdu 610036, China

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摘要近年来,基于塞贝克效应的热电技术不断取得进展,热电器件已在多个领域得以运用。然而热电器件的各连接界面存在诸多挑战。尤其是热电材料与电极的界面处在实际运用中面临电阻、热阻高,接头处易老化失效等问题。这使得热电器件的转化效率远低于理论值,可靠性不足以支持其工业化运用,热电材料的器件化进程严重滞后于新型热电材料的开发进度。为此,本文重点归纳总结了热电器件中热电材料与电极连接界面的电传输、热传输、连接性能的评估指标及相关理论,并详细介绍了各指标的测定方法和一些常见的优化策略,以期扩展热电器件的界面研究,提升热电器件的综合性能,扩大热电器件的应用范围。

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	长俊钢
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	梁奇银
	雷晓波
	蔡芳共
	张勤勇

关键词: 热电器件接触电阻界面热阻电极连接测量

Abstract: In recent years, the thermoelectric technology based on Seebeck effect has made continuous progress, and thermoelectric devices have been applied in many fields. However, there are many challenges in the interface of thermoelectric devices. In particular, the interface between thermoelectric materials and electrodes is faced with problems such as high electrical and thermal resistance, and easy aging failure at the joint in practical application. This makes the conversion efficiency of thermoelectric devices much lower than the theoretical value, and the reliability is not enough to support industrial application. The device application of thermoelectric materials lags behind the development of new thermoelectric materials. To this end, this paper mainly summarizes the evaluation indexes and related theories of electric transmission, heat transmission and connection performance of the interface between the thermoelectric materials and the electrode in the thermoelectric devices, and introduces the measurement methods of each index and some common optimization strategies in detail. In this way, the interface research of thermoelectric devices can be expanded. This will help to improve the comprehensive performance of thermoelectric devices, and thus make them more widely used.

Key words: thermoelectric device contact resistance interfacial thermal resistance electrode connection measurement

出版日期: 2024-03-25 发布日期: 2024-04-07

ZTFLH:

TN37

基金资助: 大学生创新创业训练计划-国家级创新训练项目(202210623030);西华大学“西华杯”大学生创新创业项目-登峰计划(XHB2022065)

通讯作者: ^*蔡芳共,西华大学材料科学与工程学院副教授、硕士研究生导师。2008年西南交通大学材料科学与工程专业本科毕业,2013年西南交通大学材料学专业博士毕业后到西部超导材料科技股份有限公司从事博士后研究,2016年11月至今任教于西华大学。目前主要从事热电材料与器件、光伏材料及电池等相关研究,发表论文50余篇,包括Chemistry of Materials、Materials Today Physics等。

作者简介: 长俊钢,2017年6月于西南石油大学获得工学学士学位。现为西华大学材料与化工专业硕士研究生,在蔡芳共教授的指导下进行研究。目前主要研究领域为新能源材料。

引用本文:

长俊钢, 陈玉, 何静, 梁奇银, 雷晓波, 蔡芳共, 张勤勇. 热电器件界面性能的研究现状[J]. 材料导报, 2024, 38(6): 22080238-13.
CHANG Jungang, CHEN Yu, HE Jing, LIANG Qiyin, LEI Xiaobo, CAI Fanggong, ZHANG Qinyong. Research Status of Interface Properties of Thermoelectric Devices. Materials Reports, 2024, 38(6): 22080238-13.

链接本文:

https://www.mater-rep.com/CN/10.11896/cldb.22080238 或 https://www.mater-rep.com/CN/Y2024/V38/I6/22080238

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