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材料导报  2025, Vol. 39 Issue (15): 24080240-11    https://doi.org/10.11896/cldb.24080240
  高分子与聚合物基复合材料 |
纳米导电填料在导电胶中的应用研究进展
李萍1,2,*, 倪艳荣1,2, 李承斌1,2, 周睿哲1,2, 许思上1
1 河南工学院电缆工程学院,河南 新乡 453003
2 河南工学院电缆工程学院河南省线缆结构与材料重点实验室,河南 新乡 453003
Research Progress on the Application of Nano Conductive Fillers in Conductive Adhesives
LI Ping1,2,*, NI Yanrong1,2, LI Chengbin1,2, ZHOU Ruizhe1,2, XU Sishang1
1 School of Cable Engineering, Henan Institute of Technology, Xinxiang 453003, Henan, China
2 Henan Key Laboratory of Cable Structure and Materials, School of Cable Engineering, Henan Institute of Technology, Xinxiang 453003, Henan, China
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摘要 导电胶是一种由树脂基体和导电填料复合而成的先进微电子连接材料,因其环保、低固化温度和简便的应用工艺,在液晶面板、芯片组件、印刷电路和薄膜晶体管等微电子领域得到广泛应用。然而,传统导电胶存在电阻率较高的问题,限制了其性能的进一步提升。纳米导电填料利用它独特的尺寸效应和表面效应,有效降低了导电胶的电阻率,同时增强了其力学性能,成为提升导电胶性能的关键技术。本文深入探讨了碳系、银基、导电聚合物和复合型纳米填料在导电胶中的应用进展,分析了填料种类、形态和表面性质对导电胶性能的影响,并阐释了其导电机理。同时,还展望了导电胶及其填料的未来发展方向,旨在为导电胶的技术创新和工业应用提供理论指导和实践参考。
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李萍
倪艳荣
李承斌
周睿哲
许思上
关键词:  导电胶  导电填料  导电机理  协同效应  复合纳米填料    
Abstract: Conductive adhesive, composed of a resin matrix and conductive fillers, is an advanced microelectronic component connection material. With its advantages of environmental protection, low curing temperature, and simple application process, it has been widely used in microelectronic fields such as liquid crystal panels, chip components, printed circuits, and thin-film transistors. However, the higher resistivity inherent in traditional conductive adhesives has impeded its further enhancements in performance. The incorporation of nanoscale conductive fillers with distinctive size and surface effects in the conductive adhesive can effectively reduce its resistivity and simultaneously improve its mechanical properties, thereby emerging as a pivotal technique for enhancing the performance of these adhesives. This paper deeply explores the advancements in the application of carbon-based, silver-based, conductive polymer-based and composite nano-fillers within conductive adhesives. The effects of filler types, morphologies, and surface properties on the performance of conductive adhesives were analyzed, and the mechanisms of electrical conductivity were elucidated. Furthermore, The future development direction of conductive adhesives and their fillers were proposed. These should provide theoretical guidance and practical reference for the technological innovation and industrial application of conductive adhesives.
Key words:  conductive adhesive    conductive filler    conductive mechanism    synergistic effect    composite nano-filler
出版日期:  2025-08-10      发布日期:  2025-08-13
ZTFLH:  TQ430  
基金资助: 河南省自然科学基金项目(242300421615);河南省重点研发与推广专项(242102230167;242102230175)
通讯作者:  李萍,河南工学院电缆工程学院讲师,主要研究领域为电子胶粘剂。lp@hait.edu.cn   
引用本文:    
李萍, 倪艳荣, 李承斌, 周睿哲, 许思上. 纳米导电填料在导电胶中的应用研究进展[J]. 材料导报, 2025, 39(15): 24080240-11.
LI Ping, NI Yanrong, LI Chengbin, ZHOU Ruizhe, XU Sishang. Research Progress on the Application of Nano Conductive Fillers in Conductive Adhesives. Materials Reports, 2025, 39(15): 24080240-11.
链接本文:  
https://www.mater-rep.com/CN/10.11896/cldb.24080240  或          https://www.mater-rep.com/CN/Y2025/V39/I15/24080240
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