Abstract: High quality surface processing is the key to diamond bulk and film growth and device fabrication. In this paper, laser-cut HTHP diamond was used, and the surface morphology of diamond after laser cutting was analyzed by Laser Confocal Microscopes (LEXT), Raman spectroscopy (Raman), X-ray photoelectron spectroscopy (XPS) and electron backscatter diffraction (EBSD), the transformation of the state during the polishing process, as well as the surface damage and crystal quality of the polished diamond. After two steps of mechanical polishing and chemical mechanical polishing, the carbonized layer and the damaged layer of the diamond surface are effectively removed by laser cutting, and the surface roughness reaches 0.764 nm. Further, a homogeneous thin film material is deposited on the HTHP diamond seed by a microwave plasma chemical vapor deposition (MPCVD) method to obtain a growth fringe rule, a low stress, a Raman half width of 2.1 cm-1, and a XRD half width of only 87 arcsec. High quality diamond film.
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2021, Vol. 35 
