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材料导报  2026, Vol. 40 Issue (4): 24100134-14    https://doi.org/10.11896/cldb.24100134
  高分子与聚合物基复合材料 |
微电子封装用芯片散热界面材料研究进展
彭昊燕, 薛云龙, 王秀峰*
陕西科技大学材料科学与工程学院,西安710021
Research Progress on Thermal Interface Materials for Microelectronic Packaging
PENG Haoyan, XUE Yunlong, WANG Xiufeng*
School of Materials Science and Engineering, Shaanxi University of Science and Technology, Xi′an 710021, China
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摘要 热界面材料是保证芯片正常工作必须采用的关键材料,其目的是高效导出芯片服役过程中不断产生的大量热量。本文详细介绍了热界面材料的分类和组成;分别归纳和评述了两类热界面材料的制备技术、核心性能和最新研究成果;针对热界面材料服役过程中出现的问题,阐述了热界面材料的导热机理和芯片散热效率测量方法。移动端电子产品的芯片散热界面材料正朝着高热导率、轻量化、制造与使用全程环保等方向发展。
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彭昊燕
薛云龙
王秀峰
关键词:  热界面材料  芯片散热  微电子封装  高热导率    
Abstract: Thermal interface materials (TIMs) are critical components to ensure the proper functioning of the chips, primarily by efficiently dissipating the heat continuously generated during chip operation. This review provides a comprehensive analysis of the classification and composition of TIMs, with an in-depth examination of the fabrication techniques, fundamental properties, and recent advancements of two different categories of TIMs. Additionally, this review addresses the challenges encountered during the service life of TIMs, elucidates the mechanisms underlying thermal conductivity in these materials, and outlines the measurement methods used to assess the heat dissipation efficiency of chips. In mobile electronic devices, TIMs are trending toward higher thermal conductivity, lighter weight, and more environmentally sustainable manufacturing and usage practices throughout their lifecycle.
Key words:  thermal interface material    chip cooling    microelectronic packaging    high thermal conductivity
出版日期:  2026-02-25      发布日期:  2026-02-13
ZTFLH:  TB33  
  TB34  
通讯作者:  * 王秀峰,博士,陕西科技大学二级教授、博士研究生导师。主要研究方向为陶瓷材料、电子材料。exw@sust.edu.cn   
作者简介:  彭昊燕,陕西科技大学材料科学与工程学院硕士研究生,在薛云龙副教授和王秀峰教授的指导下进行芯片散热材料的研究。
引用本文:    
彭昊燕, 薛云龙, 王秀峰. 微电子封装用芯片散热界面材料研究进展[J]. 材料导报, 2026, 40(4): 24100134-14.
PENG Haoyan, XUE Yunlong, WANG Xiufeng. Research Progress on Thermal Interface Materials for Microelectronic Packaging. Materials Reports, 2026, 40(4): 24100134-14.
链接本文:  
https://www.mater-rep.com/CN/10.11896/cldb.24100134  或          https://www.mater-rep.com/CN/Y2026/V40/I4/24100134
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