Cu/Al界面研究进展

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Abstract Copper-aluminum composite material is a new type of composite material. Because of high conductivity, thermal conductivity and strong corrosion resistance it has wide application in the fields of electronic machinery and so on. However, copper/aluminum is a heterogeneous metal combination and the physicochemical properties are quite different, which makes the interface structure very complicated. Therefore, the Cu/Al interface performance is considered to be the main reason affecting the comprehensive performance of the composite material, which has attracted wide attention. In this paper, growth of Cu/Al interface IMC, interface properties are introduced and the study by computational simulation method in Cu/Al interface is also summarized in this paper. Finally, the development direction are prospected.

Key words： copper/aluminum composite interface intermetallic compound property computational simulation

Published: 01 July 2020

CLC number:

TG146

Fund:This work was financially supported by the National Key Research and Development Programme of China(2016YFB0402602).

About author:: Xiaojie Ran received her B.S. degree in Materials Science and Engineering from Xichang College in 2018.She is currently pursuing her M.S. at the College of Material Science and Engineering,Chongqing University of Technology under the supervision of Prof.Fuxiang Huang. Her research has focused on theoretical study of functional materials ; Fuxiang Huang received his B.E. degree in Materials Science and Engineering from Chongqing University in 1985 and received his Ph.D. degree in hylology from the Tsinghua University in 2003. he is currently a full professor in Chongqing University of Technology. In recent years, his research interests are metal functional mate-rials, computational materials science, material surface and interface analysis, etc. More than 120 papers have been published in important domestic and international publications such as Scripta Materialia, and those have been cited more than 200 times by others.

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	RAN Xiaojie
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Cite this article:

RAN Xiaojie,ZHOU Lu,HUANG Fuxiang, et al. Research Progress on Interface of Cu/Al Composites[J]. Materials Reports, 2020, 34(Z1): 366-369.

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http://www.mater-rep.com/EN/ OR http://www.mater-rep.com/EN/Y2020/V34/IZ1/366

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