纳米银焊膏的研究进展

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Abstract In recent years, with the progress of electronic science and technology such as 5G and artificial intelligence, semiconductor devices are constantly developing towards the direction of intelligence, high precision, high integration and high reliability. Semiconductor devices represented by microwave RF devices of aerospace and radar, communication network base stations, large servers and power modules of new energy vehicles put forward higher requirements on the thermal conductivity and reliability of solder for semiconductor devices. Nano-silver solder paste has been widely concerned at home and abroad because of its low-temperature connection and high-temperature service performance. In this paper, the preparation and sintering mechanism of nano-silver solder paste and its sintering performance were reviewed in order to promote the research of nano-silver solder paste.

Key words： semiconductor device nano-silver solder paste preparation method sintering mechanism sintering performance

Published: 09 December 2021

CLC number:

TG425

Fund:This work was financially supported by the National Key Research and Development Program of China (2019YFF0217400).

About author:: Hongwei Dong, master,engineer, graduated from University of Science and Technology of China and mainly engaged in the development of new brazing materials and brazing process.
Yuanxun Shen, doctor, senior engineer. He graduated from institute of Metal Research of Chinese Academy of Sciences and mainly engaged in new material brazing and advanced joint technology research work, published more than 30 papers.

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	DONG Hongwei
	ZHANG Guanxing
	DONG Xian
	XUE Hangyan
	SHEN Yuanxun

Cite this article:

DONG Hongwei,ZHANG Guanxing,DONG Xian, et al. Research Progress of Nano-silver Solder Paste[J]. Materials Reports, 2021, 35(z2): 341-345.

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http://www.mater-rep.com/EN/ OR http://www.mater-rep.com/EN/Y2021/V35/Iz2/341

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