掺杂导电增强相对铝电极性能的影响

doi:10.11896/cldb.20020149

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Abstract Doped with different contents of graphene, carbon nanotubes, nano silver, silver-coated aluminum powder as the conductive reinforcement phase to prepare aluminum paste, printed it on a zinc oxide substrate and sintered at 680 ℃ to obtain aluminum electrodes, and studied the different conductive enhanced The effect of electrode conductivity and performance. The square resistance of the aluminum electrode was measured by the four-probe method, and the adhesion of the aluminum electrode was measured by a tensile tester using a secondary sintered silver electrode. The metallographic microscope, scanning electron microscope (SEM), X-ray diffractometer (XRD) and other methods were used to characterize the fiber structure, morphology and composition of the aluminum electrode doped with conductive enhanced phase. The results show that the doping content of carbon nanotubes and graphene is better at 1% and 2%, respectively. Higher than 1.5% and 3% will destroy the surface morphology of aluminum electrode, aluminum electrode has poor conductivity and low adhesion. The effect of doped nano-silver is the best, the surface of the aluminum electrode is smooth and smooth, the tissue is dense and uniform, the metal silver, and the average square resistance was determined to be 0.22 Ω/□, and the adhesion to the zinc oxide substrate reached 8.9 N/mm². At the same time, in order to determine the stability of the aluminum electrode, the resistance change rate of the aluminum electrode doped with different conductive reinforcing phases was measured experimentally at room temperature for 60 days. The results show that the changes in the ambient temperature of each group of aluminum electrodes are relatively small. The resistance change of the aluminum electrode doped with nano-silver is a minimum of 0.98%; the resistance change of the aluminum electrode doped with carbon nanotubes is a maximum of 1.52%.

Key words： doped aluminum electrode conductive enhanced phase

Published: 10 May 2021

CLC number:	TM2
	TB34

Fund:Kunming University of Science and Technology Analysis Test Fund (2018M20172230025).

About author:: Chong Wang, master student, Kunming University of Science and Technology. Main research interests are preparation and performance of electronic paste, preparation of ultrafine copper powder
Xiaoyun Zhu, professor and tutor of graduate students at Kunming University of Science and Technology. 2010.09, Ph.D., department of metallurgy, Kunming University of Science and Technology; 2008.01—2009.01, Visiting Scholar, University of Western Australia, Australia; 2016.07—2016.19, Visiting Scholar, Central Michigan University Compiled and published the book “Preparation Technology and Application of Non-ferrous Metal Special Functional Powder Materials”; won the first prize of China Nonferrous Metal Industry Technology Invention Award, won 4 provincial and ministerial level scientific and technological progress awards, 2 invention patent gold awards, Kunming City One first prize for scientific and technological progress; five authorized invention patents. Published more than 60 papers in academic journals at home and abroad, including more than 20 papers indexed by SCI and EI. Main research directions are R & D and preparation of electronic paste for microelectronics industry; R & D and preparation of special functional powder materials.

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Cite this article:

WANG Chong,ZHU Xiaoyun,LONG Jinming. Effect of Doping Conduction Enhancement on the Performance of Aluminum Electrode[J]. Materials Reports, 2021, 35(8): 8082-8087.

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http://www.mater-rep.com/EN/10.11896/cldb.20020149 OR http://www.mater-rep.com/EN/Y2021/V35/I8/8082

1 Lu G G, Xuan T P. Metallic Functional Materials,2008,15(1),48(in Chinese).
陆广广,宣天鹏.金属功能材料,2008,15(1),48.
2 Li Q, Xie Q, Ma R, et al. Materials Reports A:Review Papers,2014,28(4),31(in Chinese).
李强,谢泉,马瑞,等.材料导报:综述篇,2014,28(4),31.
3 Han W. In: The 1 8th Annual Conference of the Institute of Sensitive Technology Branch of China Electronics Society. 2011, Chengdu, pp.30.
4 Sun W T. Electronic Components and Materials,1997,16(3),14(in Chinese).
孙文通.电子元件与材料,1997,16(3),14.
5 Fan L. Insulators and Surge Arresters,2015,138(6),107(in Chinese).
范琳.电瓷避雷器,2015,138(6),107.
6 Shang R Q, Qu Y H, Cheng X L, et al. Journal of Xi'an Polytechnic University,2016,30(6),802(in Chinese).
尚润琪,屈银虎,成小乐,等.西安工程大学学报,2016,30(6),802.
7 Liu X N, Qu Y H, Cheng X L, et al. New Chemical Materials,2018,46(11),67(in Chinese).
刘晓妮,屈银虎,成小乐,等.化工新型材料,2018,46(11),67.
8 Jin Hong. Preparation of nano-silver and micro-silver-coated copper mixed slurry and performance of sintered solder joints. Master's Thesis, South China University of Technology, China,2017(in Chinese).
金虹.纳米银与微米银包铜混合浆料的制备及烧结焊点的性能研究.硕士学位论文,华南理工大学,2017.
9 Zhang Zhenhua, Guo Zhongcheng, Xiao Hongliang. Electroplating and Finishing,2007,26(1),28(in Chinese).
张振华,郭忠诚,肖红亮.电镀与涂饰,2007,26(1),28.
10 Kirkpatrick S. Reviews of Modern Physics,1973,45,574.
11 Ruschau G R, Yashikawa S, Newnham R E. Journal of Applied Physics,1992,72,953.
12 Landauer R. Electrical Conductivity in Inhomogeneous Media,1978,40,2.
13 Biswas A, Aktas O C, Schurmann U, et al. Applied Physics Letters,2004,84,2655.
14 Ma Xiaoqiang, Zhu Xiaoyun, Long Jinming, et al. Chinese Journal of Materials Research,2017,31(6),472(in Chinese).
马小强,朱晓云,龙晋明等.材料研究学报,2017,31(6),472.
15 Cao W, Song X M ,Wang B, et al. Materials Review,2007,21(S1),88(in Chinese).
曹伟,宋雪梅,王波,等.材料导报,2007,21(S1),88.
16 Wang X J, Wang Q, Yu Y M, et al. Conductive Ink,2019,40(2),45(in Chinese).
王小菊,王琪,于艺铭,等.贵金属,2019,40(2),45.
17 Xiong N N, Wang Y H, Li J Z. Rare Metal Materials and Engineering,2015,44(10),2589(in Chinese).
熊娜娜,王悦辉,李晶泽.稀有金属材料程,2015,44(10),2589.
18 Luo Q, Jiang C B, Huang W X, et al. Journal of Materials Research,2019,33(2),131(in Chinese).
骆迁,姜朝斌,黄万雄,等.材料研究学报,2019,33(2),131.
19 Zhou G J, Ye Z K, Shi W W, et al. Progress in Chemistry,2014,26(6),950(in Chinese).
周国珺,叶志凯,石微微,等.化学进展,2014,26(6),950.
20 Wang A Z, Lv M G. Chinese Polymer Bulletin,2006(5),65(in Chinese).
王安之,吕满庚.高分子通报,2006(5),65.
21 Chen Q X. Electronic Components & Materials,2006,26(3),46(in Chinese).
陈群星.电子元件与材料,2006,26(3),46.