镀铜CF/ABS树脂复合材料的导电性能

doi:10.11896/j.issn.1005-023X.2018.10.004

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Abstract The copper-coated mesophase pitch-based carbon fibers (Cu-CF) were prepared by electroless copper plating for improving the conductivity of CF, and the Cu-CF reinforced ABS resin (Cu-CF/ABS) composites were prepared using hot-pressed method. The surface morphology and microcrystalline structure of Cu-CF were characterized by SEM, EDS and XRD. The relationship between the thickness of copper layers as well as the interface structure of Cu-CF and the conductivity of composites was investigated. The results showed that the electroless copper plating was a grain size growing and crystal structure compacting process for achieving copper layers on the surface of carbon fiber. The resistivity of the Cu-CF decreased rapidly as increasing the thickness of copper layers, and the resistivity of the Cu-CF slowed to a constant level when the thickness of copper layers over 695 nm. Moreover, the Cu-CF/ABS composites presented excellent conductivity of 5.87×10^-4 Ω·cm when the resultant Cu-CF (thickness of 632 nm) used as strengthening phases with volume fraction of 20%. Therefore, the Cu-CF/ABS composites showed a great potential application for conductive functional materials.

Key words： carbon fiber composites electroless copper plating microstructure electrical conductivity

Published: 06 July 2018

CLC number:

TB332

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	Articles by authors
	ZHOU Mianhong
	CHEN Shilin
	YANG Jianxiao
	GUO Jianguang

Cite this article:

ZHOU Mianhong,CHEN Shilin,YANG Jianxiao, et al. Electrical Conductivity of Copper-coated CF/ABS Composites[J]. Materials Reports, 2018, 32(10): 1592-1596.

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http://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2018.10.004 OR http://www.mater-rep.com/EN/Y2018/V32/I10/1592

1 Lavin J G, Boyington D R, Lahijani J, et al. The correlation of thermal conductivity with electrical resistivity in mcsophase pitch-based carbon fiber[J]. Carbon,1993,31(6):1001.
2 Jana P B, Mallick A K, De S K. Effects of sample thickness and fiber aspect ratio on EMI shielding effectiveness of carbon fiber filled polychloroprene composites in the X-band frequency range[J]. IEEE Transactions on Electromagnetic Compatibility,1992,34(4):478.
3 Ma Zhaokun, Shi Jingli, Song Yan, et al. Carbon with high thermal conductivity, prepared from ribbon-shaped mesophase pitch-based fibers[J]. Carbon,2006,44(7):1298.
4 王汝敏,郑水蓉,郑亚萍.聚合物基复合材料及工艺[M].北京:科学出版社,2004:54.
5 Mochida I, Yoon S H, Korai Y. Mesoscopic structure and properties of liquid crystalline mesophase pitch and its transformation into carbon fiber[J]. Chemical Record,2010,2(2):81.
6 Gallego N C, Edie D D, Nysten B, et al. The thermal conductivity of ribbon-shaped carbon fibers[J]. Carbon,2000,38(7):1003.
7 Miyasaka K, Watannabe K, Jojima E. Electrical conductivity of carbon-polymer composites as a function of carbon content[J]. Mate-rials Science,1982,17(6):1610.
8 Carol Jones. Effects of electrochemical and plasma treatments on carbon fibre surfaces[J]. Surface and Interface Analysis,1993,20(5):357.
9 Tzeng S S, Chang F Y. EMI shielding effectiveness of metal-coated carbon fiber-reinforced ABS composites[J]. Materials Science & Engineering A,2001,302(2):258.
10 Mu B C, Liu B Y, Meng L K, et al. Spinel ceramic matrix composite reinforced by carbon fiber electroless plated[J]. Materials for Mechanical Engineering,2003,27(10):43(in Chinese).
穆柏春,刘秉余,孟力凯,等.化学镀碳纤维增强镁铝尖晶石基复合材料的研究[J].机械工程材料,2003,27(10):43.
11 Kang S S, Ji H, Gul H Z, et al. Metal-coated carbon fiber for ligh-ter electrical metal wires[J]. Synthetic Metals,2016,222:180.
12 Zuo J D, Chen S J, Luo C Y, et al. Praparation of electroless copper coated glass fiber and piezoresistive properties of copper coated glass fiber reinforced plastics[J]. Applied Surface Science,2015,349:319.
13 Lu W, Donepudi V S, Prakash J, et al. Electrochemical and thermal behavior of copper coated type MAG-20 natural graphite[J]. Electrochimica Acta,2002,47(10):1601.
14 Cui X Y, Hutt D A, Conway P P. Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate[J].Thin Solid Films,2012,520(19):6095.
15 Delamarche E, Vichiconti J, Hall S A, et al. Electroless deposition of Cu on glass and patterning with microcontact printing[J]. Langmuir,2003,19(17):6567.
16 Kim I S, Lee S K. Fabrication of carbon nanofiber/Cu composite powder by electroless plating and microstructural evolution during thermal exposure[J]. Scripta Materialia,2005,52(10):1045.
17 Huang C Y, Wu C C. The EMI shielding effectiveness of PC/ABS/nickel-coated-carbon-fibre composites[J]. European Polymer Journal,2000,36(12):2729.
18 Hou W, Pan G P, Guan H, et al. Optimization of process conditions for electroless copper plating on carbon fiber[J]. Electroplating & Finishing,2007,26(9):23(in Chinese).
侯伟,潘功配,关华,等.碳纤维表面化学镀铜工艺的优化[J].电镀与涂饰,2007,26(9):23.
19 Chen H, Liu G, Xu C, et al. Copper@carbon fiber composites prepared by a simple electroless plating technique[J]. Materials Letters,2016,173:211.
20 Yu L G,Xu K W,He J W,et al. Effect of grain size on texture and stress analysis for cubic materials[J]. Acta Metallurgica Sinica,1995,31(17):233(in Chinese).
于利根,徐可为,何家文,等.晶粒度对立方系材料织构及残余应力分析的影响[J].金属学报,1995,31(17):233.
21 Zhang G P, Li M L, Wu X M, et al. Research progress on effect of length scale on electrical resistivity of metals[J]. Materials Research,2014,28(2):81(in Chinese).
张广平,李孟林,吴细毛,等.尺度对金属材料电阻率影响的研究进展[J].材料研究学报,2014,28(2):81.
22 Sherman R D, Middleman L M, Jacobs S M. Electron transport processes in conductor-filled polymers[J]. Polymer Engineering & Science,1983,23(1):36.
23 薛奇,张峻峰,薛辰晨.塑料表面镀铜提高与树脂和金属粘接强度的方法:中国,1068291[P].1993-01-27.