Cu-3.0Ni-0.64Si合金的热变形行为

doi:10.11896/j.issn.1005-023X.2017.022.018

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Abstract The isothermal compression tests of Cu-3.0Ni-0.64Si alloy were proceed at 750—900 ℃ with the strain rate of 0.001—1 s-1. The results showed that the peak stress decreased with the increase of the deformation temperature or the decrease of the strain rate, and the alloy was prone to dynamic recrystallization. The hot deformation activation energy was 410.4 kJ/mol and the corresponding thermal deformation constitutive relation equation was ε=e40.56[sinh(0.017σ)]5.21exp [-410.4×103/(RT)] of Cu-3.0Ni-0.64Si alloy, which were obtained by the linear regression analysis. The effects of the deformation temperature and strain rate on the microstructure of Cu-3.0Ni-0.64Si alloy were discussed. The hot processing maps of different true strain were constructed based on the dynamic material model and Prasad instability criterion. The optimized process parameters were deformation temperature of 860—900 ℃ and strain rate of 0.002—0.01 s-1.

Key words： Cu-Ni-Si alloy hot compression deformation dynamic recrystallization hot processing map

Published: 08 May 2018

CLC number:

TG146.1

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	Articles by authors
	Si AlloySUN Qian
	CHEN Leng

Cite this article:

Si AlloySUN Qian,CHEN Leng. Hot Deformation Behavior of Cu-3.0Ni-0.64[J]. Materials Reports, 2017, 31(22): 90-94.

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http://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2017.022.018 OR http://www.mater-rep.com/EN/Y2017/V31/I22/90

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