| RESEARCH PAPER |
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| Effect of Nickel Layer on Microstructure Formation and Mechanical Property of Aging Treated Copper-based Bearing |
| FAN Jianglei1,2, WANG Xingxing3, WU Shen1, WANG Xiao4, GAO Hongxia1, LIU Jianxiu1
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1 Institute of Mechanical and Electrical Engineering, Zhengzhou University of Light Industry, Zhengzhou 450002;
2 Henan Key Laboratory of Mechanical Equipment Intelligent Manufacturing, Zhengzhou University of Light Industry,Zhengzhou 450002;
3 School of Mechanical Engineering, North China University of Water Resources and Electric Power,Zhengzhou 450045;
4 School of Energy and Power Engineering, Zhengzhou University of Light Industry, Zhengzhou 450002 |
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Abstract Copper-based bearings are wildly used due to their better thermal conductivity. However, the reaction between Cu and Sn dramatically decreased the bonding strength and service life of the bearing. In present paper, the effect nickel layer on the microstructure formation and mechanical property of copper-based bearing was investigated. The Ni isolated layer was prepared by electroplating on the surface of Cu-base. The Cu-based bearing with Ni layer was made by centrifugal casting. The Ni layer prevented the reaction between Sn and Cu matrix during casting. Meanwhile, the bonding strength of the bearing would not decreased. After aging at 175 ℃ for 500 h, the bonding strength of the bearing was higher than 50 MPa, which owes to the Ni layer that avoided the formation and growth of Cu6Sn5 phases during aging.
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Published: 05 May 2018
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2017, Vol. 31 
