| RESEARCH PAPER |
|
|
|
|
|
| Mechanical Properties of Directionally Solidified Polycrystalline Silicon at the Micro-/Nano-scale |
| HUANG Zheyuan1,2,3, WANG Wenxian1,2,3, YAN Zhifeng1,2,3, ZHANG Tingting1,2,3
|
1 School of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan 030024;
2 The New Material Key Laboratory of Interface Science and Engineering at the Ministry of Education, Taiyuan 030024;
3 Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024; |
|
|
|
|
Abstract Nano-indentation was used to test the hardnesses and moduli of directionally solidified polycrystalline silicon parallel to (vertical) and perpendicular to (cross-sectional) the crystal growth direction, in order to analyze the variational principle of hardness and modulus with the change of microstructure anisotropy. The hardness and modulus before indentation cracking were mea-sured via Berkovich indenter by continuous stiffness method and the distances from indentation center to crack tip were measured via SEM. Then the samples′ fracture toughnesses were calculated all at once which can avoid cracking influence on hardness and modulus. The results show that cross-sectional (110) surface′s hardness and modulus are lower than those of vertical section (111) surface, but the fracture toughness has a contrary trend. The analysis of 3D survey scanning function in indentation cracks suggested that shear sliding steps are the main causes of crack initiation. We obtained the critical indentation size by fitting the crack length and indentation size under different loadings, and it coincided well with the theoretical value.
|
|
Published: 04 May 2018
|
|
|
|
|
1 Ren N, Liu Z, Wang Q. Investigating the effects of microstructure on optical properties of different kinds of polysilicon thin films[J]. Phys Lett A,2015,379(16-17):1153.
2 Wu Y, Yuan S, Yu X, et al. Impact of carbon co-doping on the performance of crystalline silicon solar cells[J]. Solar Energy Mater Solar Cells,2016,154:94.
3 Wang J, Chuai R, Yang L, et al. A surface micromachined pressure sensor based on polysilicon nanofilm piezoresistors[J]. Sensors Actuators A: Phys,2015,228:75.
4 Su H J, Zhang J, Liu L, et al. Preparation, microstructure and dislocation of solar-grade multicrystalline silicon by directional solidification from metallurgical-grade silicon[J]. Trans Nonferrous Metals Soc China,2012,22(10):2548.
5 Yonenaga I. Hardness, yield strength, and dislocation velocity in elemental and compound semiconductors[J]. Mater Trans,2005,46(9):1979.
6 Kailer A, Gogotsi Y G, Nickel K G. Phase transformations of silicon caused by contact loading[J].J Appl Phys,1997,81(7):3057.
7 Leatherbarrow A, et al. Mechanical behaviour of the constituents inside carbon-fibre/carbon-silicon carbide composites char-acterised by nano-indentation[J]. J Eur Ceram Soc,2012,32(3):579.
8 Sebastiani M, et al. Measurement of fracture toughness by nanoindentation methods: Recent advances and future challenges[J]. Curr Opin Solid State Mater Sci,2015,19(6):324.
9 Lawn B R, Padture N P, Guiberteau F, et al. A model for microcrack initiation and propagation beneath hertzian contacts in polycrystalline ceramics[J]. Acta Metall Mater,1994,42(5):1683.
10 Harding D S, Oliver W C, Pharr G M. Cracking during nanoinden-tation and its use in the measurement of fracture toughness[J]. MRS Proceedings,1994,356:663.
11 Soares P B F, et al. Measurement of elastic modulus and Vickers hardness of surround bone implant using dynamic microindentation-parameters definition[J]. Brazilian Dental J,2014,25(5):385.
12 Tabor D. Indentation hardness: Fifty years on-A personal view[J]. Philosophical Magazine A:Phys Condensed Matter Struct Defects Mech Properties,1996,74(5):1207.
13 Cheng Y T, Cheng C M. What is indentation hardness?[J]. Surf Coat Technol,2000,133-134:417.
14 Wen S, Jiang D, Shi S, et al. Determination and controlling of crystal growth rate during silicon purification by directional solidification[J]. Vacuum,2016,125:75.
15 Gan C H, Xiong H P, Fang M, et al. Natural sedimentation of insoluble particles during directional solidification of upgraded metallurgical-grade silicon[J].J Cryst Growth,2016,439:74.
16 Lin H K, et al. Evolution of grain structures during directional soli-dification of silicon wafers[J]. J Cryst Growth,2016,439:40.
17 Guo X, Zhai C, Liu Z, et al. Effect of stacking fault in silicon induced by nanoindentation with MD simulation[J]. Mater Sci Semicond Processing,2015,30:112.
18 Shen L, Septiwerdani P, Chen Z. Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation[J]. Mater Sci Eng A,2012,558:253.
19 Pharr G M. Measurement of mechanical properties by ultra-low load indentation[J]. Mater Sci Eng A:Struct Mater Prop Microstruct Process,1998,253(1-2):151.
20 Morrell R. Fracture toughness testing for advanced technical cera-mics: Internationally agreed good practice[J]. Adv Appl Ceram,2006,105(2):88.
21 Quinn G D, Bradt R C. On the Vickers indentation fracture toughness test[J]. J Am Ceram Soc,2007,90(3):673.
22 Marshall D B, Lawn B R, Evans A G. Elastic plastic indentation damage in ceramics-The lateral crack system[J]. J Am Ceram Soc,1982,65(11):561.
23 Fischercripps A C, Lawn B R, Pajares A, et al. Stress analysis of elastic-plastic contact damage in ceramic coatings on metal substrates[J]. J Am Ceram Soc,1996,79(10):2619.
24 Anthony R, Wang N N, Casey D P, et al. MEMS based fabrication of high-frequency integrated inductors on Ni-Cu-Zn ferrite substrates[J]. J Magn Magn Mater,2016,406:89.
25 Nguyen M C, Jeon Y S, Tong D T, et al. Analysis of trap distribution in polysilicon channel transistors using the variable amplitude charge pumping method[J]. Solid-State Electron,2015,104:86. |
| [1] |
YANG Jinxiang, SHI Shuang, JIANG Dachuan, LI Xu, LI Pengting, TAN Yi, YAO Yujie, CHI Ming, ZHANG Runde, ZHANG Jianshuai. Effect of Temperature on Solidification Rate During Directional Solidification of Multicrystaline Silicon[J]. Materials Reports, 2019, 33(z1): 28-32. |
|
|
|
|
渝公网安备50019002502923号 © Editorial Office of Materials Reports.
2017, Vol. 31 
