互穿网络结构的二氧化硅/环氧树脂复合材料的制备及介电性能研究

doi:10.11896/cldb.22080082

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Abstract Epoxy resins (EP) are widely used in the field of electrical equipment and electronic packaging insulation materials, owning to their high electrical insulation performance and low dielectric loss. However, their low heat resistance and insufficient toughness had greatly limited their application in microelectronic components under high-frequency. Therefore, this work prepared a novel nano-SiO₂(E-SiO₂) with terminal epoxy group via the sol-gel process, while the silane coupling agent KH-560 and TEOS were chosen as raw materials. The prepared E-SiO₂ were then used as fillers to blend with EP (E-51). The ring opening reactions of epoxy groups on the E-SiO₂ and EP were happened under the presence of curing agent, to obtain the E-SiO₂/EP composites with interpenetrating network structure which connected by chemical bond between organic EP and inorganic E-SiO₂ fillers. The effects of E-SiO₂ content on the curing reaction process and comprehensive performance of EP resin are also researched. This work is aiming to prepare a new kind of E-SiO₂/EP composites that can be used in high frequency circuit.

Key words： epoxy resin hybrid silicon dioxide interpenetrating network structure curing kinetics dielectric property

Published: 10 March 2024 Online: 2024-03-18

CLC number:

TQ323.5

Fund:National Natural Science Foundation of China (21303135), the Project of the Natural Science Foundation of Shaanxi Province (2021JM-509), the Youth Innovation Team of Shaanxi Universities (Environmental Pollution Monitoring and Control Innovation Team, 51),the Service Local Project of Education Department of Shaanxi Province (22JC055), and the Science and Technology Program of Xi'an (21XJZZ0066, 2020KJWL03).

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	YANG Juxiang
	JIA Yuan
	MA Wenjian
	LI Pengna
	QU Yingjuan

Cite this article:

YANG Juxiang,JIA Yuan,MA Wenjian, et al. Preparation of Silicon Dioxide/Epoxy Composites with Interpenetrating Network Structure and Research on Their Dielectric Properties[J]. Materials Reports, 2024, 38(5): 22080082-6.

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http://www.mater-rep.com/EN/10.11896/cldb.22080082 OR http://www.mater-rep.com/EN/Y2024/V38/I5/22080082

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