POLYMERS AND POLYMER MATRIX COMPOSITES |
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Effects of Blending Al2O3@SiO2 Core-Shell Nanospheres on the Dielectric Properties and Space Charge Properties of Polypropylene |
HAN Kunying1, MEN Rujia1, GUO Meiqing2, LEI Zhipeng1,*, WANG Xinyu3, WANG Yifei4, SHI Zhijie1
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1 Shanxi Key Laboratory of Mining Electrical Equipment and Intelligent Control, College of Electrical and Power Engineering, Taiyuan University of Technology, Taiyuan 030024, China 2 College of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Taiyuan 030024, China 3 School of Engineering, Computing and Mathematics, University of Plymouth, Plymouth PL4 8AA, United Kingdom 4 Institute of Materials Science, University of Connecticut, Storrs 06066, USA |
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Abstract In order to study the effect of Al2O3@SiO2 core-shell nanoparticles on the properties of polypropylene (PP) nanocomposites, spherical Al2O3@SiO2 core-shell nanoparticles were synthesized by the surface precipitation method, and the PP nanocomposites with Al2O3@SiO2 core-shell nanospheres were prepared. The physicochemical properties, dielectric spectra, and space charge properties of PP nanocomposites with different contents of Al2O3@SiO2 nanoparticles were studied. The experimental results show that Al2O3@SiO2 nanospheres reduce the sto-rage modulus of PP nanocomposites and enhance their toughness. The filler content of Al2O3@SiO2 nanospheres has an evident effect on the dielectric properties and space charge properties. When the filler content is low, the core-shell structure of Al2O3@SiO2 nanospheres enhances the compatibility between fillers and the matrix and the interaction in the interface region, which further affects the charge density and carrier mobi-lity. Consequently, the relative permittivity and dielectric loss factor of PP nanocomposites decrease. The heterocharge accumulation is also suppressed, improving PP nanocomposites' dielectric and space charge properties.
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Published: 25 March 2024
Online: 2024-04-07
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Fund:National Natural Science Foundation of China (51977137), Central Guidance on Local Science and Technology Development Fund of Shanxi Province (YDZJSX2021A021), and Fundamental Research Program of Shanxi Province (202103021224115). |
Corresponding Authors:
*leizhipeng@163.com
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1 Motyl E, Moron L, Kara K. Przeglad Elektrotechniczny, 2008, 84(10), 112. 2 Tuncer E, Sauers I, James D R, et al. Nanotechnology, 2007, 18(32), 325704. 3 Takada T, Hayase Y, Tananka Y, et al. IEEE Transactions on Dielectrics and Electrical Insulation, 2008, 15(1), 152. 4 Tian F Q, Yang C, He L J, et al. Transactions of China Electrotechnical Society, 2011, 26(3), 1 (in Chinese). 田付强, 杨春, 何丽娟, 等. 电工技术学报, 2011, 26(3), 1. 5 Lewis T J. IEEE Transactions on Dielectrics and Electrical Isulation, 1994, l(5), 812. 6 Tanaka T, Montanari G C, Mulhaupt R. IEEE Transactions on Dielectrics and Electrical Insulation, 2004, 11(5), 763. 7 Tanaka T. IEEE Transactions on Dielectrics and Electrical Insulation, 2005, 12(5), 914. 8 Dettmer R. IEEE Review, 1998, 44(6), 255. 9 Li S T, Yin G L, Chen G, et al. IEEE Transactions on Dielectrics and Electrical Insulation, 2010, 17(5), 1523. 10 Tan Q, Cao Y, Irwin P. In: Conference Record of the 2007 International Conference on Solid Dielectrics. Winchester, 2007, pp. 411. 11 Lei Z P, Fabiani D, Bray T, et al. IEEE Transactions on Dielectrics and Electrical Insulation, 2021, 28(3), 753. 12 Chen Y F, Zhao H, Dong L. Acta Materiae Compositae Sinica, 2022, 39(1), 126 (in Chinese). 陈宇飞, 赵辉, 董磊. 复合材料学报, 2022, 39(1), 126. 13 Cheng Z P, Yang Y, Li F S, et al. Transactions of Nonferrous Metals Society of China, 2008, 18(2), 378. 14 Chaudhary S, Andritsch T, Vaughan A S. In: Conference Record of the 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena. Richland, 2019, pp. 729. 15 Wu C L, Zhang M Q, Rong M Z. Acta Materiae Compositae Sinica, 2002, 19(6), 61 (in Chinese). 吴春蕾, 章明秋, 容敏智. 复合材料学报, 2002, 19(6), 61. 16 Murugaraj P, Mainwaring D, Mora-Huertas N. Journal of Applied Phy-sics, 2005, 98(5), 054304. 17 Rahim, N H, Lau K Y, Muhamad N A, et al. IEEE Transactions on Dielectrics and Electrical Insulation, 2019, 26(1), 284. 18 Smith R C, Liang C, Landry M, et al. IEEE Transactions on Dielectrics and Electrical Insulation, 2008, 15(1), 187. 19 Montanari G C, Mazzanti G, Palmieri F, et al. In: Proceedings of the 6th International Conference on Properties and Applications of Dielectric Materials. Xi'an, 2000, pp. 38. 20 Lei Q Q, Tian F Q, Yang C, et al. Journal of Electrostatics, 2010, 68(3), 243. |
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