Si<sub>3</sub>N<sub>4</sub>/W高温共烧陶瓷的制备与研究

doi:10.11896/cldb.22040171

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Abstract Silicon nitride (Si₃N₄) ceramics, with good thermal conductivity and excellent mechanical properties, have great development prospect in high-power electronic devices. The realization of high temperature co-firing of Si₃N₄ ceramics and metal is of great significance for the application of Si₃N₄ ceramics in electronic devices. The substrate materials commonly used in high temperature co-firing technology are alumina, zirconia and aluminum nitride ceramics. In view of this, this work used Si₃N₄ ceramics as substrate materials, combining tape casting, screen prin-ting and high temperature co-firing technology to prepare Si₃N₄ multilayer co-firing components, and explored the influence of the sintering additive (Er₂O₃) content on the properties of Si₃N₄ ceramics. The debonding process, interface structure and composition, and conductivity of Si₃N₄ multilayer components were analyzed and discussed. The results showed that at the Er₂O₃ content of 9%, and the relative density, shrinkage, thermal conductivity and bending strength of Si₃N₄ ceramics were 95.35%, 10.33%, 69.94 W/(m·K) and (807.33±10.34) MPa, respectively. The debonding process for Si₃N₄ multilayer components was determined:increasing the temperature up to 600 ℃ with 1 h holding in vacuum at the heating rate of 1 ℃/min. The thickness of the W layer in the obtained Si₃N₄ multilayer component was about 7 μm, and the boundary between the W layer and the Si₃N₄ ceramic layer was obvious. There was a mechanical interlocking structure developed with the presence of W₅Si₃ at the interface due to the reaction between Si₃N₄ and W. The sheet resistance of the module was 0.878 Ω/sq, which proved that the component showed electrical conductivity. This work provided a new substrate material for high temperature co-firing technology, and also developed the technology of the high temperature co-firing of Si₃N₄ ceramics with metal, helping to expand the application of Si₃N₄ ceramics in electronics industry.

Key words： high temperature co-firing technology silicon nitride ceramics screen printing tungsten

Published: 10 September 2023 Online: 2023-09-05

CLC number:

TQ174

Fund:National Natural Science Foundation of China (52102082) and Shanghai Sailing Program (21YF1454500).

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	DAI Jinrong
	TANG Zhihong
	DUAN Yusen
	ZHANG Jingxian

Cite this article:

DAI Jinrong,TANG Zhihong,DUAN Yusen, et al. Preparation and Study of Si₃N₄/W High Temperature Co-fired Ceramics[J]. Materials Reports, 2023, 37(17): 22040171-6.

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http://www.mater-rep.com/EN/10.11896/cldb.22040171 OR http://www.mater-rep.com/EN/Y2023/V37/I17/22040171

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