有机硅改性环氧树脂薄膜封装材料的制备及性能研究

doi:10.11896/cldb.20120032

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Abstract In this work, an epoxy-based silicone resin (SER) conforming to the flexible thin-film encapsulation process was synthesized through the hydrosilylation reaction. On this basis, the dynamic thermomechanical properties, mechanical properties, hydrophobicity, coefficient of thermal expansion (CTE) and thermal properties of SER/EP cured films with different compositions were systematically analyzed. The results show that when the addition of SER is 10% (mass fraction of epoxy resin (EP) mass), the tensile strength of the cured film gets 47.11 MPa, which increases by 17.8% compared with that of pure EP; when the addition of SER increases to 25%, T_g gradually decreases, with the crosslink density decreasing from 2.26 mol·m^-3 to 0.8 mol·m^-3. The flexibility of the SER/EP cured film can reach 1 mm, and obvious ductile fracture characteristics are also observed by SEM micromorphology characterization. The hydrophobicity of the SER/EP cured film is enhanced, and thus the contact angle increased by 32.1°. Especially, when the addition of SER is 30%, the SER/EP cured film has a lower CTE₁(8×10^-6/℃)(25 ℃＜T＜50 ℃,T<T_g), and CTE₂ decreases to 12.78×10^-6/℃(70 ℃＜T＜150 ℃,T>T_g). Finally, the availability of SER/EP adhesive solution in the film encapsulation field was further verified through the inkjet printing.

Key words： film encapsulation epoxy resin epoxy silicone resin flexibility coefficient of thermal expansion inkjet printing

Published: Online: 2022-06-09

CLC number:

TQ317.3

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	Articles by authors
	JI Jingru
	XU Zhipeng
	QIANG Junfeng
	LIU Yuhong

Cite this article:

JI Jingru,XU Zhipeng,QIANG Junfeng, et al. Preparation and Performance of Organic Silicon Modified Epoxy Resin of Film Encapsulation Materials[J]. Materials Reports, 2022, 36(11): 20120032-9.

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http://www.mater-rep.com/EN/10.11896/cldb.20120032 OR http://www.mater-rep.com/EN/Y2022/V36/I11/20120032

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