高导热金刚石/铜复合材料的制备与界面调控研究进展

doi:10.11896/cldb.20090233

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Abstract Diamond/copper composites show great prospect in thermal management applications due to their high thermal conductivity(TC) and low coefficient of thermal expansion (CTE) in theory. However, the actual TC is far below the theoretical TC, because of the poor interface affinity between diamond and copper. At usual atmospheric pressure, even the molten cooper can not wet the diamond. So the gaps with the high thermal resistance usually can be found between diamond and cooper. Optimized sintering and interface control techniques are usually used to improve the actual TC of diamond/copper composites (Dia/Cu). In this paper, the sintering techniques such as high temperature and high pressure, vacuum hot-pressing sintering, spark plasma sintering and infiltration are summarized. The bonding of diamond/copper interface can be strengthened by adding metal elements into copper matrix and surface metallization of diamond. Moreover, the problems of diamond/copper composites preparation and interface modification are pointed out, as well as the development trend.

Key words： diamond/copper composites (Dia/Cu) thermal conductivity (TC) coefficient of thermal expansion (CTE) interface modification

Published: 10 August 2022 Online: 2022-08-15

CLC number:

TG333

Fund:Natural Science Foundation of Hebei Province (E202008069).

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	Articles by authors
	GUO Jing
	MENG Yongqiang
	SUN Jinfeng
	ZHANG Shaofei

Cite this article:

GUO Jing,MENG Yongqiang,SUN Jinfeng, et al. Research Progress in the Preparation and Interface Modification of High Thermal Conductivity Diamond/Copper Composites[J]. Materials Reports, 2022, 36(15): 20090233-7.

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http://www.mater-rep.com/EN/10.11896/cldb.20090233 OR http://www.mater-rep.com/EN/Y2022/V36/I15/20090233

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