热电器件各界面优化方法研究综述

doi:10.11896/cldb.20060216

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Abstract The widespread application of thermoelectric technology and devices have attracted the attention of researchers all over the world. One of the effective ways to improve the conversion efficiency of thermoelectric devices is to optimize its ability of conductivity and heat transfer through analyzing the structure. This paper indicated the influence of interfaces such as ceramic substrate, metal electrode, interface layer and thermoelectric leg on the internal conductivity and heat transfer performance of Bi₂Te₃ thermoelectric device. This paper illustrated the problems and rela-ted solutions of both interface and connection interface in the practical design and application of the thermoelectric devices. In addition, the shor-tage in the design and optimization of thermoelectric devices are presented in this study.

Key words： Bi₂Te₃ thermoelectric device interface layer thermoelectric leg interface optimization

Published: 03 November 2021

CLC number:

TK11+5

Fund:National Natural Science Foundation of China (51590902,51676117,51876111), the “Shuguang Program” (18SG54), the Program of Graduate Student Foundation of Shanghai Polytechnic University (EGD19YJ0030).

About author:: Feng Shi, currently studying for a master's degree in enviromental engineering at Shanghai Polytechnic University,conducts research work under the guidance of Professor Zihua Wu. The current main research area is thermoelectric device.
Zihua Wu, graduated from the Shanghai Institute of Ceramics, Chinese Academy of Sciences wtih a professional doctorate. He is currently the professor of Shanghai Polytechnic University. The current main research area is design and fabrication of new energy materials and devices. He has presided over a number of projects such as National Natural Science Foundation of China Youth Fund, general projects, Shanghai Shuguang plan, innovation fund of Shanghai Education Commission, etc. More than 50 SCI papers have been published in Applied Physics Letter, Journal of Applied Physics and other domestic and foreign journals, and more than 20 invention patents have been applied, including 12 autho-rized invention patents and 2 authorized utility models.

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	SHI Feng
	ZOU Jiapu
	WU Zihua
	XIE Huaqing
	WANG Yuanyuan

Cite this article:

SHI Feng,ZOU Jiapu,WU Zihua, et al. Interface Optimization of Thermoelectric Device—a Review[J]. Materials Reports, 2021, 35(19): 19049-19054.

URL:

http://www.mater-rep.com/EN/10.11896/cldb.20060216 OR http://www.mater-rep.com/EN/Y2021/V35/I19/19049

1 Gao D, Ren G P, Li Q F, et al. Journal of Chongqing University of Technology(Natural Science), 2021, 35(9), 269(in Chinese).
高迪, 任庚坡, 李琦芬, 等. 重庆大学学报(自然科学), 2021, 35(9), 269.
2 Fan L, Zhang G, Wang R, et al. Energy Conversion & Management, 2016, 122, 85.
3 Khan M Q,Malarmannan S,Manikandaraja G. Iop Conference, 2018, 402, 1.
4 Ghilvacs M, Prisecaru T, Pop H, et al. Iop Conference, 2016, 147(1), 012147.
5 Liu K, Ding T, Li J, et al. Advanced Energy Materials, 2018, 8(13), 1702481.
6 Zhang Y, Gurzadyan G G, Umair M M, et al. Chemical Engineering Journal, 2018, 344, 402.
7 Nader W B. Applied Thermal Engineering, 2019, 167, 114761.
8 Bahk J H, Fang H, Yazawa K, et al. Journal of Materials Chemistry C, 2015, 3(40), 10362.
9 Kim C S, Lee G S, Choi H, et al. Applied Energy, 2018, 214, 131.
10 Bell L E. Science, 2008, 321, 1457.
11 Xu D S. Semiconductor refrigeration and application technology, Shanghai Jiaotong University Press, China, 1999(in Chinese).
徐德胜. 半导体制冷与应用技术,上海交通大学出版社,1999.
12 El-Genk M S, Saber H H. Energ Convers Manage, 2003, 44, 1069.
13 Hu X, Jood P, Ohta M, et al. Energy & Environmental science, 2016, 9(2), 517.
14 Rezania A, Rosendahl L A. Journal of Electronic Materials, 2012, 41(6), 1343.
15 Shimizu K, Takase Y, Takeda M. Journal of Electronic Materials, 2009, 38(7), 1371.
16 Swamy K,Satyanarayan. Materials Today: Proceedings,2020,35(1),1.
17 Xuan X C,Ng K C,Yap C,et al. International Journal of Heat & Mass Transfer,2002,45(26), 5159.
18 Mao J H,Wu Z H,Xie H Q,et al. Journal of Thermophysics and Heat Transfer,2018, 1.
19 Sakamoto T, Iida T, Sekiguchi T, et al. Journal of Electronic Materials, 2014, 43(10), 3792.
20 Börner F D, Schreier M, Feng B, et al. Journal of Materials Research, 2014, 29(16), 1771.
21 Suarez F, Nozariasbmarz A, Vashaee D, et al. Energy & Environmental Science, 2016, 9(6), 2099.
22 Zhang Q H, Huang X Y, Bai S Q, et al. Advanced Engineering Mate-rials, 2016, 18(2), 194.
23 Tan M, Deng Y, Hao Y. Energy, 2014, 77, 591.
24 Pham N H, Farahi N, Kamila H, et al. Materials Today Energy, 2019, 11, 97.
25 Zhou H, Mu X, Zhao W, et al. Nano Energy, 2017, 40, 274.
26 Liu W, Jie Q, Kim H S, et al. Acta Materialia, 2015, 87, 357.
27 Shen J, Wang Z, Chu J, et al. ACS Applied Materials & Interfaces, 2019, 14182.
28 Hu X K, Zhang S M, Zhao F, et al. Journal of Inorganic Materials, 2019,34(3), 269(in Chinese).
胡晓凯, 张双猛, 赵府, 等. 无机材料学报,2019,34(3), 269.
29 Rowe D M. Thermoelectrics handbook: macro to nano, CRC Press, America, 2005.
30 Zhao D, Tian C, Tang S, et al. Materials Science in Semiconductor Processing, 2010, 13(3), 221.
31 Wang L, Lu X, Yu X, et al. Heat Transfer Research, 2019, 51(3), 1.
32 Lin T Y, Liao C N, Wu A T. Journal of Electronic Materials, 2012, 41(1), 153.
33 Li J, Zhao S, Chen J, et al. ACS Applied Materials & Interfaces, 2020, 12(16), 18562.
34 Yusufu E, Sugahara T, Okajima M, et al. Journal of Alloys and Compounds, 2020, 817, 1.
35 Song B, Lee S, Cho S, et al. Journal of Alloys & Compounds, 2014, 617, 160.
36 Abbas M S, Thanh H L, Van N N. Materials Today: Proceedings, 2019, 8, 625.
37 Kunioka H, Obara H, Yamamoto A, et al. Materials Transactions, 2018, 59(7), 1035.
38 Gu M, Xia X G, Huang X Y, et al. Journal of Alloys & Compounds, 2014, 610, 665.
39 Chen L, Mei D, Wang Y, et al. Journal of Alloys and Compounds, 2019, 796, 314.
40 Lan Y C, Wang D Z, Chen G, et al. Applied Physics Letters, 2008, 92(10), 101910.
41 Hsieh H C, Wang C H, Lan T W, et al. Materials Chemistry and Phy-sics, 2020, 246, 122848.
42 Fan J, Chen L, Bai S, et al. Materials Letters, 2004, 58(30), 3876.
43 Chen S W, Chu A H, Wong D S H, et al. Journal of Alloys & Compounds. 2017, 699, 448.
44 Chen L D, Liu R H, Shi X. Thermoelectric materials and devices, Science Press, China, 2017.
45 Ebling D, Bartholomé K, Bartel M, et al. Journal of Electronic Mate-rials, 2010, 39(9), 1376.
46 Kumar S, Heister S D, Xu X, et al. Journal of Electronic Materials, 2015, 44(10), 3627.
47 Zhang Q, Liao J, Tang Y, et al. Energy & Environmental Science, 2017, 10(4), 956.
48 Lavric E D. Sensitivity analysis of thermoelectric module performance with respect to geometry, 2010, 21, 133.
49 Wu Y, Yang J, Chen S, et al. Energy, 2018, 147, 672.
50 Yee S K, Leblanc S, Goodson K E, et al. Energy & Environment Science, 2013, 6(9), 2561.
51 Meng J H, Zhang X X, Wang X D. Energy, 2014, 71, 367.
52 Shittu S, Li G Q, Zhao X D, Ma X L. Applied Energy, 2020, 268,115075.
53 Lamba R, Kaushik S C, Tyagi S K, et al. Thermal Science and Enginee-ring Progress, 2018, 6, 236.
54 Li G Q, Shittu S, Ma X L, et al. Energy, 2019, 171, 599.
55 Siddique A R M, Mahmud S, Heyst B V. Energy,2020, 19, 6.
56 Zebarjadi M. Scientific Reports, 2016, 6, 20951.
57 Lv S, Liu M H, He W, et al. Energy Conversion and Management, 2020, 207, 112516.