Wetting Behavior and Interfacial Characteristics of Sn-0.7Cu Solder on Amorphous Fe84.3Si10.3B5.4 Alloy at Different Temperatures
HOU Bin1, LIU Fengmei1, WANG Hongqin2, LI Qi1, WAN Di1, ZHANG Yupeng1
1 Guangdong Provincial Key Laboratory of Advanced Welding Technology, Guangdong Welding Institute (China-Ukraine E.O.Paton Institute of Welding), Guangzhou 510650; 2 Reliability Research and Analysis Center, The Fifth Research Institute of MITT, P. R, Guangzhou 510610
Abstract: The sessile drop method and scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS) was used to study the static wetting and interfacial microstructure morphology of Sn, Sn-37Pb, Sn-58Bi and Sn-0.7Cu on amorphous Fe84.3Si10.3B5.4substrate. The research results showed that Sn-0.7Cu alloy was selected as better solder for amorphous Fe84.3Si10.3B5.4alloy. The wetting behavior of Sn-0.7Cu solder on amorphous Fe84.3Si10.3B5.4alloy at different temperatures was investigated by sessile drop method. The microstructure morphology and composition of Sn-0.7Cu solder/amorphous alloy substrate interface was analyzed by SEM and EDS. With increasement of soldering temperature, the final equilibrium wetting angle of Sn-0.7Cu solder on amorphous Fe84.3Si10.3B5.4 alloy substrate was getting smaller and smaller, and the wettability was better. At the same time, the thickness of intermetallic compound (FeSn2) forming at the interface between Sn-0.7Cu solder and amorphous Fe84.3Si10.3B5.4 alloy substrate gradually increased which was from discontinuous to continuous distribution, and the interfacial reaction increased gradually.
侯斌, 刘凤美, 王宏芹, 李琪, 万娣, 张宇鹏. 不同温度下Sn-0.7Cu钎料在非晶Fe84.3Si10.3B5.4合金上的润湿行为及界面特征[J]. 材料导报, 2018, 32(18): 3208-3212.
HOU Bin, LIU Fengmei, WANG Hongqin, LI Qi, WAN Di, ZHANG Yupeng. Wetting Behavior and Interfacial Characteristics of Sn-0.7Cu Solder on Amorphous Fe84.3Si10.3B5.4 Alloy at Different Temperatures. Materials Reports, 2018, 32(18): 3208-3212.
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2018, Vol. 32 
