银铜复合带在低过载电流下沿界面分断的失效机理研究

doi:10.11896/cldb.24040030

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Abstract The Ag/Cu composite strip, replacing Ag with Cu, represents a new generation of fuse material with a wide market application prospect compared with pure Ag fuse material due to its advantages such as saving Ag and reducing cost, meeting the needs of high power, high and low voltage circuit fuse protection. There is an abnormal failure phenomenon that the composite strip breaks along the Ag/Cu interface under low times of overload current instead of breaking at the narrow diameter of pure Ag. For this phenomenon, the abnormal break failure mode and mechanism of Ag/Cu composite strips were revealed by studying the interfacial microstructure evolution, element distribution and electrical properties before and after bending and before and after the low overload current test in different bending processes. The results show that the bending process changes the break failure mode of the composite strips, and when the fold is at the Ag/Cu interface, the local stress causes microcracks around the Ag/Cu interface. When the low-fold overload current passes through the strip, under the role of skin effect in the interface surface layer, the existence of microcracks makes the local resistance increase, causing rapid heat accumulation. A significant number of Cu atoms diffused through the interface to the Ag strip, resulting in the formation of large-sized low-melting point Ag/Cu eutectic zones with lower breaking conditions. Due to the difference in the diffusion rate of Ag and Cu atoms, it easily forms a large number of Kirkendall voids at the interface, which can subsequently expand to create a large crater-like structure through the strip to cause damage, resulting in the strip along the Ag/Cu interface breaking abnormal failure.

Key words： Ag/Cu composite strip fuse material microstructure evolution Ag-Cu eutectic break mechanism

Published: 10 May 2025 Online: 2025-04-28

CLC number:	TG454
	TM241

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	Articles by authors
	ZHANG Shannan
	HOU Jiangtao
	SHEN Yuanxun
	ZHONG Sujuan
	QIN Jian
	LONG Weimin

Cite this article:

ZHANG Shannan,HOU Jiangtao,SHEN Yuanxun, et al. Failure Mechanism of Ag/Cu Composite Strips Break Along the Interface Under Low Overload Current[J]. Materials Reports, 2025, 39(9): 24040030-5.

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https://www.mater-rep.com/EN/10.11896/cldb.24040030 OR https://www.mater-rep.com/EN/Y2025/V39/I9/24040030

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