搅拌速度对废电路板酸浸液中脉冲电沉积铜箔的影响

doi:10.11896/cldb.24090116

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Abstract In this work, copper foil was prepared by pulsed electrodeposition based on the acid leaching solution of waste printed circuit board, and the effect of stirring speed on the microstructure and properties of copper foil was studied. The results show that copper foil can be obtained when the stirring speed is more than 200 r/min. As the stirring speed continues to increase, the grains become finer and more compact, and the grain orientation tends to the highly preferred (220) crystal plane. When the stirring speed is 400 r/min, the tensile strength and elongation of copper foil are more than twice as high as those of 200 r/min, and the purity is almost unchanged. When the stirring speed is 600 r/min, the purity of copper foil decreases from 99.91% to 99.71%, the tensile strength decreases by 39.8%, and the elongation decreases slightly. The stirring speed affects the microstructure and properties of copper foil by controlling the mass transfer rate to change the grain size and preferred orientation of crystal planes. When the stirring speed is 400 r/min, the smooth and dense copper foil can be obtained, and its purity, tensile strength and elongation reach 99.91%, 218.9 MPa and 20.6%, respectively.

Key words： waste printed circuit board copper foil acid leaching solution stirring speed pulsed electrodeposition

Published: 25 September 2025 Online: 2025-09-11

CLC number:	TF811
	X705

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	Articles by authors
	SUN Yan
	LIU Hongjun
	LI Yamin
	LI Weisheng

Cite this article:

SUN Yan,LIU Hongjun,LI Yamin, et al. Effect of Stirring Speed on Pulsed Electrodeposition of Copper Foil from Acid Leaching Solution of Waste Printed Circuit Board[J]. Materials Reports, 2025, 39(18): 24090116-7.

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https://www.mater-rep.com/EN/10.11896/cldb.24090116 OR https://www.mater-rep.com/EN/Y2025/V39/I18/24090116

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