METALS AND METAL MATRIX COMPOSITES |
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Effects of Copper Foil Substrate on Graphene Growth by Chemical Vapor Deposition |
WANG Yunpeng1,2, LIU Yuning1,2, WANG Tongbo1,2, ZHANG Jianing1,2, MO Yongda1,2, LOU Huafen3,*
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1 China Copper Institute of Engineering and Technology, Beijing 102209, China 2 Kunming Metallurgical Research Institute Co., Ltd., Beijing Branch, Beijing 102209, China 3 Chinalco Research Institute of Science and Technology Co., Ltd., Beijing 102209, China |
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Abstract Copper foil for graphene growth by chemical vapor deposition (CVD) usually requires smooth surface, large grain size and large area of Cu (111) crystal face. In this study, commercial rolled copper foil and electrolytic copper foil with different thickness were used to prepare graphene. The differences of copper foil surface morphology, grain size and the proportion of Cu (111) crystal face were compared, and the differences of graphene grown on the two kinds of copper foil under the same preparation conditions were discussed. It was found that the surface roughness of electrolytic copper foil was larger than that of rolled copper foil after surface pretreatment and annealing treatment. Due to the large deformation experienced by the rolled copper foil, the grain size of annealed copper foil was about 37 μm and the proportion of Cu (111) crystal face was about 40%, while that of electrolytic copper foil was about 24 μm and the proportion of Cu (111) crystal face was about 28%. The area of graphene was land on rolled copper foil was larger than that of electrolytic copper foil, and the defects of graphene was less than that of electrolytic copper foil. The graphene prepared on rolled copper foil was better than that on electrolytic copper foil under the same conditions.
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Published: 10 July 2024
Online: 2024-08-01
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Fund:Beijing Science and Technology Plan Project (Z211100004521005) and Strategic Frontier Technology Major Project of Chinalco Group (2022ZL015013). |
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1 Zhang W Y, Quan S J, Sensor World, 2011, 17(5), 6 (in Chinese). 张文毓, 全识俊. 传感器世界, 2011, 17(5), 6. 2 Zhou H L, Yu W J, Liu L X, et al. Nature Communications, 2013, 4, 2096. 3 Xiao X Y, Li Y C, Liu Z P. Nature Materials, 2016, 15(7), 697. 4 Zhang W, Man W D, Tu X, et al. Vacuum & Cryogenics, 2013, 3(4), 195 (in Chinese). 张玮, 满卫东, 涂昕, 等. 真空与低温, 2013, 3(4), 195. 5 Cai J W, Feng K Q, Wang H B, et al. Materials Reports, 2024, 38(1), 154(in Chinese). 蔡锦文, 冯可芹, 王海波, 等. 材料导报, 2024, 38(1),154. 6 Li H, Fu Z B, Wang H B, et al. Acta Physica Sinica, 2017, 66(5), 058101 (in Chinese). 李浩, 付志兵, 王红斌, 等, 物理学报, 2017, 66(5), 058101. 7 Sun Y F, Wang X J, Song J C, et al. Printed Circuit Information, 2016, 24(9), 36 (in Chinese). 孙云飞, 王学江, 宋佶昌, 等. 印制电路信息, 2016, 24(9), 36. 8 Zhang Z H, Xu X Z, Qiu L, et al. Advanced Science, 2017, 4(9), 1700087. 9 Feng W, Zhang J H, Yang L Q. Journal of Functional Materials, 2015, 46(1), 01129 (in Chinese). 冯伟, 张建华, 杨连乔. 功能材料, 2015, 46(1), 01129. 10 Chen M, Yan Y, Zhang X F, et al. Journal of Aeronautical Materials, 2015, 35(2), 1 (in Chinese). 陈牧, 颜悦, 张晓锋, 等. 航空材料学报, 2015, 35(2), 1. 11 Yi M. Functional Materials Information. 2015, 12(3), 60 (in Chinese). 佚名. 功能材料信息, 2015, 12(3), 60. 12 Cao M, Xiong D B, Yang L, et al. Advanced Functional Materials, 2019, 29(17), 1806792. 13 Xu X Z, Zhang Z H, Dong J C, et al. Science Bulletin, 2017, 62(15), 1074. 14 Liu J G. Printed Circuit Information, 2015, 23(2), 13 (in Chinese). 刘建广. 印制电路信息, 2015, 23(2), 13. 15 Fang J, Zhang H, Xia T D, et al. Metallic Functional Materials, 2018, 25(3), 6 (in Chinese). 方军, 张涵, 夏天东, 等. 金属功能材料, 2018, 25(3), 6. 16 Liu X Q, Yin J C, Lin Z D. Journal of Materials Science & Engineering, 2019, 37(5), 763 (in Chinese). 刘湘祁, 尹建成, 林正得. 材料科学与工程学报, 2019, 37(5), 763. 17 Sun F T, Feng A H, Yu Y, et al. Journal of Inorganic Materials, 2020, 35(10), 1177. 18 赵泰真, 李先珩, 朴瑟气, 等. 中国专利, CN109072466A, 2018. 19 Polsen E S, McNerny D Q, Viswanath B, et al. Scientific Reports, 2015, 5(1), 10257. 20 Song R L, Liu P, Zhang K, et al. Journal of Materials Science & Engineering, 2016, 34(1), 96 (in Chinese). 宋瑞利, 刘平, 张柯, 等. 材料科学与工程学报, 2016, 34(1), 96. 21 Wood J D, Schmucker S W, Lyons A S, et al. Nano Letters, 2011, 11(11), 4547. 22 Liang Y M, Zhou J X, Zhang Y Q. Materials for Mechanical Engineering, 2015, 39(7), 25 (in Chinese). 梁勇明, 周建新, 张芸秋. 机械工程材料, 2015, 39(7), 25. |
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