Preparation and Properties of Waterborne Silicone Modified Epoxy Resin
HE Lihong1,*, MA Yuefan1, YANG Ke1, XU Xinshuo2, LI Qinglin1
1 School of Materials Science and Engineering, Chongqing Jiaotong University, Chongqing 400074, China 2 School of Civil Engineering, Chongqing Jiaotong University, Chongqing 400074, China
Abstract: Silicone modified epoxy resin was synthesized by the condensation reaction between dichlorodimethylsilane(DMDCS) and -OH of epoxy resin E51, and waterborne silicone modified epoxy resin was prepared by reverse transfer method, and the synthesis conditions of silicone modified epoxy resin were optimized by hydrophobicity. The influence of emulsification process on the average particle size of emulsion was analyzed, and the properties of cured film were investigated. The results showed that epoxy resin 40 g, DMDCS 1.6 g, solvent dosage 20 mL, reaction at 50 ℃ for 8 h, the contact angle between silicone modified epoxy resin and water was 106.8°; emulsifier dosage 25%, emulsification temperature 65 ℃, shear speed 3 000 r/min, average particle size of waterborne silicone modified epoxy resin emulsion was 1.011 μm, storage stability (30 d) and centrifugal stability (3 000 r/min, 30 min)were good. Waterborne silicone modified epoxy curing film had shorter curing time, excellent hydrophobicity, mechanical properties, corrosion resistance.
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