镀银铜纳米颗粒的制备与应用研究进展

Abstract
Figure/Table
References
Related Citation (15)

Download:

Full Text ( PDF ) (7645KB)
Export: BibTeX | EndNote (RIS)

Abstract Silver-plated copper nanoparticles have been widely used in many fields because of their excellent electrical conductivity, effective oxidation resistance and high cost performance. This article first introduces the preparation methods of silver-plated copper nanoparticles, including displacement method, reduction method, composite method, mechanical ball milling method and melting atomization method, etc. The control mechanism of the preparation process is discussed. Then,their applications in conductive adhesives, electromagnetic shielding coatings and conductive inks are discussed. Finally, the synthesis and application of silver-plated copper nanoparticles are prospected.

Key words： silver-coated copper nanoperticles preparation method conductive filler conductive application

Published: 05 June 2022 Online: 2022-06-08

CLC number:

O648

Fund:National Natural Science Foundation of China (21761016), Major R & D Project of Yunnan Province (202002AB080001-1, 202102AB080008-5), Young and Middle-aged Academic and Technical Leaders Reserve Talents Program of Yunnan Province (2017HB060), and Ten Thousand Talents Plan-Young Top Talent Program of Yunnan Province.

	Service
	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	CHEN Jie
	FAN Zhengyang
	MAO Huaming
	YIN Jungang
	LI Yao
	DAI Wei
	YANG Hongwei

Cite this article:

CHEN Jie,FAN Zhengyang,MAO Huaming, et al. Progress in the Preparation and Application of Silver-plated Copper Nanoparticles[J]. Materials Reports, 2022, 36(Z1): 21090201-4.

URL:

http://www.mater-rep.com/EN/ OR http://www.mater-rep.com/EN/Y2022/V36/IZ1/21090201

1 Lee J W, Han G Y, Lee D S, et al. Small, 2018, 14(8), 1703312.
2 Muhamad A J, Nazish S, Muhammad R, et al. Materials Today Procee-dings, 2021, 47(supplement), S55.
3 Young M C, Sang S L, Chong R P, et al. Composites Part A, 2021, 149, 106562.
4 Andritsosa K, Theodorakosa I, Zacharatosa F, et al. Applied Surface Science, 2020, 506, 144968.
5 Artur J M, Aman D. Materials for Renewable and Sustainable Energy, 2018, 7(3), 195.
6 Peng J, Chen B, Wang Z C, et al. Nature, 2020, 586(7829), 390.
7 Wang W, Wang M, Ambrosi E, et al. Nature Communications, 2019, 10, 81.
8 余凤斌, 郭涵, 曹建国. 电镀与环保, 2011, 31(6), 26.
9 Alexander I T, Olga A L, Alexander M V, et al. Materials Today Proceedings, 2020, 25(3), 447.
10 Huang H J, Wu X, Ma X, et al. In: 20th International Conference on Electronic Packaging Technology. Hong Kong, China, 2019, pp. 245273.
11 武博, 朱晓云, 曹梅, 等. 材料研究学报, 2018, 32(10), 775.
12 Zhang Y, Zhu L P, Li G, et al. Applied Materials & Interfaces, 2019, 11(8), 8382.
13 Dai X F, Xu W, Zhang T, et al. Chemical Engineering Journal, 2019, 364, 310.
14 Sakthisabarimoorthi A, Jose M, Dhas S A M B, et al. Journal of Mate-rials Science: Materials in Electronics, 2017, 28(6), 4545.
15 Gaurav A K, Chang Y, Wojciech T O. The Journal of Physical Chemistry Letters, 2020, 11(13), 5318.
16 宁玲, 梁静, 钟长江, 等.广东印刷, 2017(3), 41.
17 Thomas M, Sonia S N, Thierry B. Journal of Nanoparticle Research, 2019, 21(6), 116.
18 Zhao K, Liu Y, Zhang T, et al. In: 18th International Conference on Electronic Packaging Technology, Harbin, 2017, pp. 1497.
19 Zhang X M, Yang X Y, Wang B. International Journal of Adhesion and Adhesives, 2021, 105, 102785.
20 Meng D R, Wang L M, Zhang J G, et al. In: Materials Science Forum. Switzerland, 2017, pp. 898.
21 Huang Y, Wu F S, Zhou Z, et al. Nanotechnology, 2020, 31(17), 175601.
22 姚瑶. 基于镀银铜粉填料的高导电复合材料的制备与性能研究.硕士学位论文, 电子科技大学, 2020.
23 李玉虎, 刘志宏, 刘付朋, 等. 中国专利, CN103949635 B, 2016.
24 刘成. 贵金属, 2009, 30(4), 25.
25 Jung D S, Li H M, Kang Y C, et al. Journal of Colloid and Interface Science, 2011, 2(364), 574.
26 陆伟华, 邵玮, 黄建.中国专利, CN106835048 A, 2017.
27 张小敏, 李起龙, 杜海涛, 等. 高校化学工程学报, 2020, 34(4), 1069.
28 汪星华, 张秋敏, 李明, 等.电镀与涂饰, 2019, 39(10), 655.
29 Liu P, Wang P, Deng Y Q, et al. In: IOP Conference Series: Earth and Environmental Science. Xi'an, 2019, pp. 022068.
30 Liu Y J, Yu Y T, Zhao X M. The Journal of the Textile Institute, 2020, 112(9), 1324.
31 魏昂, 郑泽军, 位威. 中国专利, CN109852146 A, 2019.
32 Alexander I T, Olga A L, Alexander M V, et al. Colloids and Surfaces A, 2019, 577, 500.